netdev - Re: [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP sections for E825C

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Date: Tue, 12 Dec 2023 10:02:06 +0000
From: Simon Horman <horms@...nel.org>
To: Grzegorz Nitka <grzegorz.nitka@...el.com>
Cc: intel-wired-lan@...ts.osuosl.org, netdev@...r.kernel.org
Subject: Re: [PATCH iwl-next v1 3/3] ice: add support for 3k signing DDP
 sections for E825C

On Wed, Dec 06, 2023 at 08:29:19PM +0100, Grzegorz Nitka wrote:
> E825C devices shall support the new signing type of RSA 3K for new DDP
> section (SEGMENT_SIGN_TYPE_RSA3K_E825 (5) - already in the code).
> The driver is responsible to verify the presence of correct signing type.
> Add 3k signinig support for E825C devices based on mac_type:
> ICE_MAC_GENERIC_3K_E825;
> 
> Signed-off-by: Grzegorz Nitka <grzegorz.nitka@...el.com>

Reviewed-by: Simon Horman <horms@...nel.org>