linux-kernel - Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer driver

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Date:	Fri, 09 Aug 2013 11:16:40 -0400
From:	"Ivan T. Ivanov" <iivanov@...sol.com>
To:	balbi@...com
Cc:	rob.herring@...xeda.com, pawel.moll@....com, mark.rutland@....com,
	swarren@...dotorg.org, ian.campbell@...rix.com, rob@...dley.net,
	gregkh@...uxfoundation.org, grant.likely@...aro.org,
	idos@...eaurora.org, mgautam@...eaurora.org,
	devicetree@...r.kernel.org, linux-doc@...r.kernel.org,
	linux-kernel@...r.kernel.org, linux-usb@...r.kernel.org,
	linux-omap@...r.kernel.org, linux-arm-msm@...r.kernel.org
Subject: Re: [RFC PATCH v2 3/3] usb: dwc3: Add Qualcomm DWC3 glue layer
 driver


Hi, 

On Fri, 2013-08-09 at 16:32 +0300, Felipe Balbi wrote:
> On Fri, Aug 09, 2013 at 12:53:47PM +0300, Ivan T. Ivanov wrote:
> > From: "Ivan T. Ivanov" <iivanov@...sol.com>
> > 
> > DWC3 glue layer is hardware layer around Synopsys DesignWare
> > USB3 core. Its purpose is to supply Synopsys IP with required
> > clocks, voltages and interface it with the rest of the SoC.
> > 
> > Signed-off-by: Ivan T. Ivanov <iivanov@...sol.com>
> 
> same comments from previous version.
> 

Sorry, I have somehow missed Your email.
I will address them shortly.

Regard,
Ivan

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