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Message-id: <52300E5A.7010202@samsung.com>
Date: Wed, 11 Sep 2013 08:31:54 +0200
From: Marek Szyprowski <m.szyprowski@...sung.com>
To: Rob Herring <robherring2@...il.com>
Cc: linux-kernel@...r.kernel.org, linaro-mm-sig@...ts.linaro.org,
devicetree@...r.kernel.org,
Kyungmin Park <kyungmin.park@...sung.com>,
Arnd Bergmann <arnd@...db.de>,
Michal Nazarewicz <mina86@...a86.com>,
Grant Likely <grant.likely@...retlab.ca>,
Tomasz Figa <t.figa@...sung.com>,
Sylwester Nawrocki <s.nawrocki@...sung.com>,
Sascha Hauer <s.hauer@...gutronix.de>,
Laura Abbott <lauraa@...eaurora.org>,
Olof Johansson <olof@...om.net>,
Pawel Moll <pawel.moll@....com>,
Mark Rutland <mark.rutland@....com>,
Stephen Warren <swarren@...dotorg.org>,
Ian Campbell <ian.campbell@...rix.com>,
Tomasz Figa <tomasz.figa@...il.com>,
Kumar Gala <galak@...eaurora.org>,
Nishanth Peethambaran <nishanth.p@...il.com>,
Marc <marc.ceeeee@...il.com>, Guenter Roeck <linux@...ck-us.net>
Subject: Re: [PATCH] drivers: of: fix build break if asm/dma-contiguous.h is
missing
Hello,
On 9/10/2013 9:45 PM, Rob Herring wrote:
> On 09/10/2013 04:13 AM, Marek Szyprowski wrote:
> > It is not needed to include asm/dma-contiguous.h header to compile
> > reserved memory initialization code, so remove it to avoid build break
> > on architectures without CMA support.
> >
> > Signed-off-by: Marek Szyprowski <m.szyprowski@...sung.com>
>
> Acked-by: Rob Herring <rob.herring@...xeda.com>
>
> I can apply this or it can go with other CMA stuff.
I think it will be best if I push it to Linus asap to fix the build break
on arm64 and mips, introduced by my pull request. It is really strange that
I got no report from linux-next about that issue, although this patch was
there for about 2 weeks.
> Aren't there also some comments from Grant to address as well?
Right, I'm working on providing an update which will address the issues
pointed by Grant, but I got sick and had to take some days off. I still
didn't recover completely, but I hope I will manage to finish them by
the end of the week.
Best regards
--
Marek Szyprowski
Samsung R&D Institute Poland
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