linux-kernel - Re: [RESEND PATCH v2] documentation: docbook: document process of writing an musb glue layer

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Date:	Mon, 28 Apr 2014 12:52:04 -0500
From:	Felipe Balbi <balbi@...com>
To:	Apelete Seketeli <apelete@...eteli.net>
CC:	Felipe Balbi <balbi@...com>, Randy Dunlap <rdunlap@...radead.org>,
	Michal Marek <mmarek@...e.cz>,
	Masahiro Yamada <yamada.m@...panasonic.com>,
	Rob Landley <rob@...dley.net>, Jiri Kosina <jkosina@...e.cz>,
	David Fries <David@...es.net>,
	"Robert P. J. Day" <rpjday@...shcourse.ca>,
	Ben Hutchings <ben@...adent.org.uk>,
	Lars-Peter Clausen <lars@...afoo.de>,
	Linux Documentation List <linux-doc@...r.kernel.org>,
	Linux USB List <linux-usb@...r.kernel.org>,
	Linux Kernel List <linux-kernel@...r.kernel.org>
Subject: Re: [RESEND PATCH v2] documentation: docbook: document process of
 writing an musb glue layer

On Mon, Apr 28, 2014 at 07:30:26PM +0200, Apelete Seketeli wrote:
> Hi Felipe,
> 
> On Mon, Apr-14-2014 at 10:12:56 PM +0200, Apelete Seketeli wrote:
> > Document the process of writing an musb glue layer by taking the
> > Ingenic JZ4740 glue layer as an example, as it seems more simple than
> > most glue layers due to the basic feature set of the JZ4740 USB device
> > controller.
> > 
> > Signed-off-by: Apelete Seketeli <apelete@...eteli.net>
> 
> This one wasn't part of the pull request for 3.15-rc3, so I was
> wondering if you are planning to pull it in the next round of fixes
> (if it qualifies as such) or just waiting for the 3.16 merge window ?

yeah, probably. I'll get to this by the end of the week.

-- 
balbi

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