linux-kernel - Re: [PATCH v5 2/4] dt-bindings: document Rockchip thermal

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Message-ID: <541ADD58.7070901@rock-chips.com>
Date:	Thu, 18 Sep 2014 21:25:44 +0800
From:	Caesar Wang <caesar.wang@...k-chips.com>
To:	Tomeu Vizoso <tomeu@...euvizoso.net>
CC:	heiko@...ech.de, rui.zhang@...el.com, edubezval@...il.com,
	Arnd Bergmann <arnd@...db.de>,
	"linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
	linux-pm@...r.kernel.org,
	"linux-arm-kernel@...ts.infradead.org" 
	<linux-arm-kernel@...ts.infradead.org>,
	"devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
	linux-doc@...r.kernel.org, huangtao@...k-chips.com,
	cf@...k-chips.com, dianders@...omium.org, dtor@...omium.org,
	dmitry.torokhov@...il.com, addy.ke@...k-chips.com,
	zyf@...k-chips.com, cjf@...k-chips.com
Subject: Re: [PATCH v5 2/4] dt-bindings: document Rockchip thermal

Tomeu,

在 2014年09月18日 17:27, Tomeu Vizoso 写道:
> On 17 September 2014 05:59, Caesar Wang <caesar.wang@...k-chips.com> wrote:
>> This add the necessary binding documentation for the thermal
>> found on Rockchip SoCs
> Hi Caesar,
>
> is there any reason to not use the existing thermal bindings? You can
> find a description in
> Documentation/devicetree/bindings/thermal/thermal.txt and example code
> in omap, or in the patches for Tegra recently posted by Mikko
> Perttunen.
>
> Regards,
>
> Tomeu

Why should I use the existing thermal bindings?
I believe omap,tegar and rockchip are  the three seperate thermals driver.

So far, I submitted the series Patchs for rockchip thermal.
>
>> Signed-off-by: zhaoyifeng <zyf@...k-chips.com>
>> Signed-off-by: Caesar Wang <caesar.wang@...k-chips.com>
>> ---
>>   .../bindings/thermal/rockchip-thermal.txt          | 41 ++++++++++++++++++++++
>>   1 file changed, 41 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
>>
>> diff --git a/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
>> new file mode 100644
>> index 0000000..6fc8bc3
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/rockchip-thermal.txt
>> @@ -0,0 +1,41 @@
>> +* Temperature Sensor ADC (TSADC) on rockchip SoCs
>> +
>> +Required properties:
>> +- compatible: "rockchip,rk3288-tsadc"
>> +- reg: physical base address of the controller and length of memory mapped
>> +       region.
>> +- interrupts: The interrupt number to the cpu. The interrupt specifier format
>> +             depends on the interrupt controller.
>> +- clocks: Must contain an entry for each entry in clock-names.
>> +- clock-names: Shall be "tsadc" for the converter-clock, and "apb_pclk" for
>> +              the peripheral clock.
>> +- num-trips:  number of total trip points, this is required, set it 0 if none,
>> +             if greater than 0, the following properties must be defined;
>> +- tripN-temp: temperature of trip point N, should be in ascending order;
>> +- tripN-type: type of trip point N, should be one of "active" "passive" "hot"
>> +             "critical";
>> +- tripN-cdev-num: number of the cooling devices which can be bound to trip
>> +                 point N, this is required if trip point N is defined, set it 0 if none,
>> +                 otherwise the following cooling device names must be defined;
>> +- tripN-cdev-nameM: name of the No. M cooling device of trip point N;
>> +
>> +Example:
>> +tsadc: tsadc@...80000 {
>> +       compatible = "rockchip,rk3288-tsadc";
>> +       reg = <0xff280000 0x100>;
>> +       interrupts = <GIC_SPI 37 IRQ_TYPE_LEVEL_HIGH>;
>> +       clocks = <&cru SCLK_TSADC>, <&cru PCLK_TSADC>;
>> +       clock-names = "tsadc", "apb_pclk";
>> +
>> +       num-trips = <2>;
>> +
>> +       trip0-temp = <80>;
>> +       trip0-type = "passive";
>> +       trip0-cdev-num = <1>;
>> +       trip0-cdev-name0 = "thermal-cpufreq-0";
>> +
>> +       trip1-temp = <100>;
>> +       trip1-type = "critical";
>> +       trip1-cdev-num = <1>;
>> +       trip1-cdev-name0 = "thermal-cpufreq-0";
>> +};
>> --
>> 1.9.1
>>
>>
>> --
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>
>

-- 
Best regards,
Caesar


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