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Message-ID: <54E1EA25.3000308@kapsi.fi> Date: Mon, 16 Feb 2015 15:01:25 +0200 From: Mikko Perttunen <mikko.perttunen@...si.fi> To: Eduardo Valentin <edubezval@...il.com>, Rui Zhang <rui.zhang@...el.com>, ezequiel.garcia@...e-electrons.com, amit.kachhap@...aro.org, viresh.kumar@...aro.org, amit.daniel@...sung.com, hongbo.zhang@...aro.com, andrew@...n.ch, durgadoss.r@...el.com, peter@...e.net, shawn.guo@...aro.org, aaron.lu@...el.com, caesar.wang@...k-chips.com, b.zolnierkie@...sung.com, l.majewski@...sung.com, vincenzo.frascino@...com, mperttunen@...dia.com, srinivas.pandruvada@...ux.intel.com, jacob.jun.pan@...ux.intel.com, bcousson@...libre.com CC: LKML <linux-kernel@...r.kernel.org>, Linux PM <linux-pm@...r.kernel.org> Subject: Re: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary On 02/09/2015 11:34 PM, Eduardo Valentin wrote: > This change introduces a section in the Introduction Chapter to > list concepts used by the Thermal Framework. > > Signed-off-by: Eduardo Valentin <edubezval@...il.com> > --- > Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++- > 1 file changed, 128 insertions(+), 1 deletion(-) > > diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl > index f8fb8a2..66efed3 100644 > --- a/Documentation/DocBook/thermal.tmpl > +++ b/Documentation/DocBook/thermal.tmpl > @@ -84,5 +84,132 @@ > devices. > </para> > > - </chapter> > + <sect1 id="glossary"> > + <title>Glossary</title> > + <para>The Linux Kernel Thermal Framework uses a > + specific terminology to represent the entities involved > + in thermal constrained environments. This section > + summaries the terminology as dictionary. These terms are > + in use within the present document and in the source > + code of the Linux Kernel Thermal Framework. > + </para> > + <glossary> > + <glossentry> > + <glossterm>Thermal Zone</glossterm> > + <glossdef> > + <para>Thermal zones represent > + what is the current status of a > + thermal constrained zone in the > + hardware. The zone usually is a > + device or component. The status > + of a thermal zone is mainly with > + respect to temperature. > + Currently, the Linux Kernel > + Thermal Framework represents > + temperature in miliCelsius. The milli-Celsius or millicelsius. Same change later too. > + current abstraction covers for > + non negative temperatures and > + constraints. > + </para> > + </glossdef> > + </glossentry> > + <glossentry> > + <glossterm>Thermal Sensors</glossterm> > + <glossdef> > + <para>Thermal sensors provide > + temperature sensing capabilities > + on thermal zones. Typical > + devices are I2C ADC converters > + and bandgaps. These are nodes > + providing temperature data to > + thermal zones. Thermal sensor > + devices may control one or more > + internal sensors. > + </para> > + </glossdef> > + </glossentry> > + <glossentry> > + <glossterm>Trips Points</glossterm> > + <glossdef> > + <para>The trip node describes a > + point in the temperature domain > + in which the system takes an > + action. This item describes just > + the point, not the action. Trip > + points are represented as > + temperature in miliCelsius. The here > + current abstraction covers for > + non negative temperatures. One thing I'd also like to see documented is the roles of the different trip types (PASSIVE, ACTIVE, HOT, CRITICAL) and when each should be used. > + </para> > + </glossdef> > + </glossentry> > + <glossentry> > + <glossterm>Thermal Governor</glossterm> > + <glossdef> > + <para>Thermal Governors > + represent a policy to manage the > + thermal zone device temperature. > + The governor targets to keep > + temperature in an acceptable > + range which correlates to the > + power budget, while maximizing > + the performance. Governors can > + be implemented in Kernel Space > + or in User Space. > + </para> > + </glossdef> > + </glossentry> > + <glossentry> > + <glossterm>Thermal Cooling Device</glossterm> > + <glossdef> > + <para>Cooling devices provide > + control on power dissipation. > + There are essentially two ways > + to provide control on power > + dissipation. First is by means > + of regulating device > + performance, which is known as > + passive cooling. A typical > + passive cooling is a CPU that > + has dynamic voltage and > + frequency scaling (DVFS), and > + uses lower frequencies as > + cooling states. Second is by > + means of activating devices in > + order to remove the dissipated > + heat, which is known as active > + cooling, e.g. regulating fan > + speeds. In both cases, cooling > + devices shall have a way to > + determine the state of cooling > + in which the device is. > + </para> > + </glossdef> > + </glossentry> > + <glossentry> > + <glossterm>Cooling State</glossterm> > + <glossdef> > + <para>Any cooling device has a > + range of cooling states (i.e. > + different levels of heat > + dissipation). For example a > + fan's cooling states correspond > + to the different fan speeds > + possible. Cooling states are > + referred to by single unsigned > + integers, where larger numbers > + mean greater heat dissipation. > + The precise set of cooling > + states associated with a device > + (as referred to be the > + cooling-min-state and > + cooling-max-state properties) > + should be defined in a > + particular device's binding. > + </para> > + </glossdef> > + </glossentry> > + </glossary> > + </sect1> > + </chapter> > </book> > Cheers, Mikko. -- To unsubscribe from this list: send the line "unsubscribe linux-kernel" in the body of a message to majordomo@...r.kernel.org More majordomo info at http://vger.kernel.org/majordomo-info.html Please read the FAQ at http://www.tux.org/lkml/
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