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Message-ID: <20150216151742.GC8648@developer.hsd1.ca.comcast.net>
Date: Mon, 16 Feb 2015 11:17:43 -0400
From: Eduardo Valentin <edubezval@...il.com>
To: Randy Dunlap <rdunlap@...radead.org>
Cc: Rui Zhang <rui.zhang@...el.com>,
ezequiel.garcia@...e-electrons.com, amit.kachhap@...aro.org,
viresh.kumar@...aro.org, amit.daniel@...sung.com,
hongbo.zhang@...aro.com, andrew@...n.ch, durgadoss.r@...el.com,
peter@...e.net, shawn.guo@...aro.org, aaron.lu@...el.com,
caesar.wang@...k-chips.com, b.zolnierkie@...sung.com,
l.majewski@...sung.com, vincenzo.frascino@...com,
mperttunen@...dia.com, mikko.perttunen@...si.fi,
srinivas.pandruvada@...ux.intel.com, jacob.jun.pan@...ux.intel.com,
bcousson@...libre.com, LKML <linux-kernel@...r.kernel.org>,
Linux PM <linux-pm@...r.kernel.org>
Subject: Re: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal
Framework DocBook
On Tue, Feb 10, 2015 at 02:50:36PM -0800, Randy Dunlap wrote:
> On 02/09/15 13:34, Eduardo Valentin wrote:
>
> > + <chapter id="introduction">
> > + <title>Introduction</title>
> > + <para>Thermal management is any method or technique implied to
> > + mitigate emergencies caused by operating devices within
> > + unsupported temperatures. The challenge consists of designing a
>
> I would flip the ending of that sentence:
> caused by operating devices outside of
> supported temperatures.
>
> > + product keeping the junction temperature of the IC components.
> > + The operating temperature of IC components used on products must
> > + operate within their design limits. Besides, temperature towards
> > + device enclosure must be in a comfort level for the user.
> > + Therefore, thermal management, by the time of this writing,
> > + starts in very early device design phase. Managing thermal may
> > + involve different disciplines, at different stages, such as
> > + temperature monitoring, floorplanning, microarchitectural
> > + techniques, compiler techniques, OS techniques, liquid cooling,
> > + and thermal reliability or security. This document covers what
> > + the Linux Kernel Thermal Framework provides as abstraction to
> > + users with respect to thermal management.
> > + </para>
> > + <para>One of the first proposals to provide a solution to cover
> > + the thermal problem appears in the Advanced Configuration and
> > + Power Interface (ACPI) specification. ACPI provides an open
> > + standard for device configuration and power management by the
> > + operating system. However, several computing devices which may
> > + have thermal issues in the market disregard the ACPI standard.
> > + Therefore, the Linux Kernel Thermal Framework has been designed
> > + to serve as abstraction for ACPI and non-ACPI systems. The core
> > + concepts applies in both types of systems.
> > + </para>
> > + <para>The Linux Kernel Thermal Framework has a design which
> > + represents the different thermal constraints found in an
>
> drop: an^^
>
> > + end-products. The thermal constraints exist to serve different
> > + purposes. There two major types of thermal constraints. The
>
> There are two
>
> > + first is related to components junction temperature. The second
> > + is related to the level of comfort while end users are handling
> > + devices.
> > + </para>
> > +
> > + </chapter>
> > +</book>
> >
>
>
> --
> ~Randy
Thanks Randy for checking this up. I apologize for forgetting Ccing you
in my original post. I will fix the text as per your suggestions and
also copy you in next version.
Thanks for you time.
Eduardo Valentin
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