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Message-ID: <20150216151907.GD8648@developer.hsd1.ca.comcast.net>
Date: Mon, 16 Feb 2015 11:19:09 -0400
From: Eduardo Valentin <edubezval@...il.com>
To: Randy Dunlap <rdunlap@...radead.org>
Cc: Rui Zhang <rui.zhang@...el.com>,
ezequiel.garcia@...e-electrons.com, amit.kachhap@...aro.org,
viresh.kumar@...aro.org, amit.daniel@...sung.com,
hongbo.zhang@...aro.com, andrew@...n.ch, durgadoss.r@...el.com,
peter@...e.net, shawn.guo@...aro.org, aaron.lu@...el.com,
caesar.wang@...k-chips.com, b.zolnierkie@...sung.com,
l.majewski@...sung.com, vincenzo.frascino@...com,
mperttunen@...dia.com, mikko.perttunen@...si.fi,
srinivas.pandruvada@...ux.intel.com, jacob.jun.pan@...ux.intel.com,
bcousson@...libre.com, LKML <linux-kernel@...r.kernel.org>,
Linux PM <linux-pm@...r.kernel.org>
Subject: Re: [PATCH RFC 02/12] Documentation: thermal docbook: add glossary
Randy
On Tue, Feb 10, 2015 at 02:50:47PM -0800, Randy Dunlap wrote:
> On 02/09/15 13:34, Eduardo Valentin wrote:
> > This change introduces a section in the Introduction Chapter to
> > list concepts used by the Thermal Framework.
> >
> > Signed-off-by: Eduardo Valentin <edubezval@...il.com>
> > ---
> > Documentation/DocBook/thermal.tmpl | 129 ++++++++++++++++++++++++++++++++++++-
> > 1 file changed, 128 insertions(+), 1 deletion(-)
> >
> > diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl
> > index f8fb8a2..66efed3 100644
> > --- a/Documentation/DocBook/thermal.tmpl
> > +++ b/Documentation/DocBook/thermal.tmpl
> > @@ -84,5 +84,132 @@
> > devices.
> > </para>
> >
> > - </chapter>
> > + <sect1 id="glossary">
> > + <title>Glossary</title>
> > + <para>The Linux Kernel Thermal Framework uses a
> > + specific terminology to represent the entities involved
> > + in thermal constrained environments. This section
> > + summaries the terminology as dictionary. These terms are
>
> summarizes
>
> > + in use within the present document and in the source
> > + code of the Linux Kernel Thermal Framework.
> > + </para>
> > + <glossary>
> > + <glossentry>
> > + <glossterm>Thermal Zone</glossterm>
> > + <glossdef>
> > + <para>Thermal zones represent
> > + what is the current status of a
> > + thermal constrained zone in the
> > + hardware. The zone usually is a
> > + device or component. The status
> > + of a thermal zone is mainly with
> > + respect to temperature.
> > + Currently, the Linux Kernel
> > + Thermal Framework represents
> > + temperature in miliCelsius. The
> > + current abstraction covers for
> > + non negative temperatures and
>
> non-negative
>
> > + constraints.
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + <glossentry>
> > + <glossterm>Thermal Sensors</glossterm>
> > + <glossdef>
> > + <para>Thermal sensors provide
> > + temperature sensing capabilities
> > + on thermal zones. Typical
> > + devices are I2C ADC converters
> > + and bandgaps. These are nodes
> > + providing temperature data to
> > + thermal zones. Thermal sensor
> > + devices may control one or more
> > + internal sensors.
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + <glossentry>
> > + <glossterm>Trips Points</glossterm>
>
> Trip Points
>
> > + <glossdef>
> > + <para>The trip node describes a
> > + point in the temperature domain
> > + in which the system takes an
> > + action. This item describes just
> > + the point, not the action. Trip
> > + points are represented as
> > + temperature in miliCelsius. The
> > + current abstraction covers for
> > + non negative temperatures.
>
> non-negative
>
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + <glossentry>
> > + <glossterm>Thermal Governor</glossterm>
> > + <glossdef>
> > + <para>Thermal Governors
> > + represent a policy to manage the
> > + thermal zone device temperature.
> > + The governor targets to keep
> > + temperature in an acceptable
> > + range which correlates to the
> > + power budget, while maximizing
> > + the performance. Governors can
> > + be implemented in Kernel Space
> > + or in User Space.
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + <glossentry>
> > + <glossterm>Thermal Cooling Device</glossterm>
> > + <glossdef>
> > + <para>Cooling devices provide
> > + control on power dissipation.
> > + There are essentially two ways
> > + to provide control on power
> > + dissipation. First is by means
> > + of regulating device
> > + performance, which is known as
> > + passive cooling. A typical
> > + passive cooling is a CPU that
> > + has dynamic voltage and
> > + frequency scaling (DVFS), and
> > + uses lower frequencies as
> > + cooling states. Second is by
> > + means of activating devices in
> > + order to remove the dissipated
> > + heat, which is known as active
> > + cooling, e.g. regulating fan
> > + speeds. In both cases, cooling
> > + devices shall have a way to
> > + determine the state of cooling
> > + in which the device is.
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + <glossentry>
> > + <glossterm>Cooling State</glossterm>
> > + <glossdef>
> > + <para>Any cooling device has a
> > + range of cooling states (i.e.
> > + different levels of heat
> > + dissipation). For example a
> > + fan's cooling states correspond
> > + to the different fan speeds
> > + possible. Cooling states are
> > + referred to by single unsigned
> > + integers, where larger numbers
> > + mean greater heat dissipation.
> > + The precise set of cooling
> > + states associated with a device
> > + (as referred to be the
> > + cooling-min-state and
> > + cooling-max-state properties)
> > + should be defined in a
> > + particular device's binding.
> > + </para>
> > + </glossdef>
> > + </glossentry>
> > + </glossary>
> > + </sect1>
> > + </chapter>
> > </book>
> >
>
>
> --
> ~Randy
Fixing all the above in next version.
Thanks,
Eduardo Valentin
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