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Message-ID: <20150218111308.GC2990@e104805>
Date: Wed, 18 Feb 2015 11:13:08 +0000
From: Javi Merino <javi.merino@....com>
To: Eduardo Valentin <edubezval@...il.com>
Cc: Rui Zhang <rui.zhang@...el.com>,
"ezequiel.garcia@...e-electrons.com"
<ezequiel.garcia@...e-electrons.com>,
"amit.kachhap@...aro.org" <amit.kachhap@...aro.org>,
"viresh.kumar@...aro.org" <viresh.kumar@...aro.org>,
"amit.daniel@...sung.com" <amit.daniel@...sung.com>,
"hongbo.zhang@...aro.com" <hongbo.zhang@...aro.com>,
"andrew@...n.ch" <andrew@...n.ch>,
"durgadoss.r@...el.com" <durgadoss.r@...el.com>,
"peter@...e.net" <peter@...e.net>,
"shawn.guo@...aro.org" <shawn.guo@...aro.org>,
"aaron.lu@...el.com" <aaron.lu@...el.com>,
"caesar.wang@...k-chips.com" <caesar.wang@...k-chips.com>,
"b.zolnierkie@...sung.com" <b.zolnierkie@...sung.com>,
"l.majewski@...sung.com" <l.majewski@...sung.com>,
"vincenzo.frascino@...com" <vincenzo.frascino@...com>,
"mperttunen@...dia.com" <mperttunen@...dia.com>,
"mikko.perttunen@...si.fi" <mikko.perttunen@...si.fi>,
"srinivas.pandruvada@...ux.intel.com"
<srinivas.pandruvada@...ux.intel.com>,
"jacob.jun.pan@...ux.intel.com" <jacob.jun.pan@...ux.intel.com>,
"bcousson@...libre.com" <bcousson@...libre.com>,
LKML <linux-kernel@...r.kernel.org>,
Linux PM <linux-pm@...r.kernel.org>
Subject: Re: [PATCH RFC 01/12] Documentation: Introduce Linux Kernel Thermal
Framework DocBook
On Mon, Feb 09, 2015 at 09:34:02PM +0000, Eduardo Valentin wrote:
> This patch adds a book about the Linux Kernel Thermal Framework.
> In this change, only a brief introduction is added together with
> Makefile changes.
>
> Signed-off-by: Eduardo Valentin <edubezval@...il.com>
> ---
> Documentation/DocBook/Makefile | 3 +-
> Documentation/DocBook/thermal.tmpl | 88 ++++++++++++++++++++++++++++++++++++++
> 2 files changed, 90 insertions(+), 1 deletion(-)
> create mode 100644 Documentation/DocBook/thermal.tmpl
>
> diff --git a/Documentation/DocBook/Makefile b/Documentation/DocBook/Makefile
> index 9c7d92d..8163508 100644
> --- a/Documentation/DocBook/Makefile
> +++ b/Documentation/DocBook/Makefile
> @@ -15,7 +15,8 @@ DOCBOOKS := z8530book.xml device-drivers.xml \
> 80211.xml debugobjects.xml sh.xml regulator.xml \
> alsa-driver-api.xml writing-an-alsa-driver.xml \
> tracepoint.xml drm.xml media_api.xml w1.xml \
> - writing_musb_glue_layer.xml crypto-API.xml
> + writing_musb_glue_layer.xml crypto-API.xml thermal.xml
> + writing_musb_glue_layer.xml
Duplicated writing_musb_glue_layer.xml ? Looks like the second line
should be removed.
>
> include Documentation/DocBook/media/Makefile
>
> diff --git a/Documentation/DocBook/thermal.tmpl b/Documentation/DocBook/thermal.tmpl
> new file mode 100644
> index 0000000..f8fb8a2
> --- /dev/null
> +++ b/Documentation/DocBook/thermal.tmpl
> @@ -0,0 +1,88 @@
> +<?xml version="1.0" encoding="UTF-8"?>
> +<!DOCTYPE book PUBLIC "-//OASIS//DTD DocBook XML V4.1.2//EN"
> + "http://www.oasis-open.org/docbook/xml/4.1.2/docbookx.dtd" []>
> +
> +<book id="thermal-api">
> + <bookinfo>
> + <title>Linux Kernel Thermal Framework API</title>
> +
> + <authorgroup>
> + <author>
> + <firstname>Eduardo</firstname>
> + <surname>Valentin</surname>
> + <affiliation>
> + <address>
> + <email>evalenti@...nel.org</email>
> + </address>
> + </affiliation>
> + </author>
> + </authorgroup>
> +
> + <copyright>
> + <year>2008-2014</year>
> + <holder>Eduardo Valentin</holder>
> + <holder>Sujith Thomas</holder>
> + <holder>Zhang Rui</holder>
> + </copyright>
> + <legalnotice>
> + <para>
> + This documentation is free software; you can redistribute
> + it and/or modify it under the terms of the GNU General Public
> + License version 2 as published by the Free Software Foundation.
> + </para>
> +
> + <para>
> + This program is distributed in the hope that it will be
> + useful, but WITHOUT ANY WARRANTY; without even the implied
> + warranty of MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.
> + See the GNU General Public License for more details.
> + </para>
> +
> + <para>
> + For more details see the file COPYING in the source
> + distribution of Linux.
> + </para>
> + </legalnotice>
> + </bookinfo>
> +
> +<toc></toc>
> +
> + <chapter id="introduction">
> + <title>Introduction</title>
> + <para>Thermal management is any method or technique implied to
> + mitigate emergencies caused by operating devices within
> + unsupported temperatures. The challenge consists of designing a
> + product keeping the junction temperature of the IC components.
> + The operating temperature of IC components used on products must
> + operate within their design limits. Besides, temperature towards
> + device enclosure must be in a comfort level for the user.
> + Therefore, thermal management, by the time of this writing,
> + starts in very early device design phase. Managing thermal may
> + involve different disciplines, at different stages, such as
> + temperature monitoring, floorplanning, microarchitectural
> + techniques, compiler techniques, OS techniques, liquid cooling,
> + and thermal reliability or security. This document covers what
> + the Linux Kernel Thermal Framework provides as abstraction to
> + users with respect to thermal management.
> + </para>
> + <para>One of the first proposals to provide a solution to cover
> + the thermal problem appears in the Advanced Configuration and
> + Power Interface (ACPI) specification. ACPI provides an open
> + standard for device configuration and power management by the
> + operating system. However, several computing devices which may
> + have thermal issues in the market disregard the ACPI standard.
> + Therefore, the Linux Kernel Thermal Framework has been designed
> + to serve as abstraction for ACPI and non-ACPI systems. The core
> + concepts applies in both types of systems.
> + </para>
> + <para>The Linux Kernel Thermal Framework has a design which
> + represents the different thermal constraints found in an
> + end-products. The thermal constraints exist to serve different
> + purposes. There two major types of thermal constraints. The
are
> + first is related to components junction temperature. The second
> + is related to the level of comfort while end users are handling
> + devices.
> + </para>
> +
> + </chapter>
> +</book>
Cheers,
Javi
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