linux-kernel - Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

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Message-ID: <9hh4mh4bdoi.fsf@e105922-lin.cambridge.arm.com>
Date:	Mon, 02 Nov 2015 15:53:33 +0000
From:	Punit Agrawal <punit.agrawal@....com>
To:	Viresh Kumar <viresh.kumar@...aro.org>
Cc:	Dawei Chien <dawei.chien@...iatek.com>,
	"Rafael J. Wysocki" <rjw@...ysocki.net>,
	Rob Herring <robh+dt@...nel.org>,
	Pawel Moll <pawel.moll@....com>,
	Mark Rutland <mark.rutland@....com>,
	Ian Campbell <ijc+devicetree@...lion.org.uk>,
	Kumar Gala <galak@...eaurora.org>,
	Matthias Brugger <matthias.bgg@...il.com>,
	Daniel Kurtz <djkurtz@...omium.org>,
	Sascha Hauer <s.hauer@...gutronix.de>,
	Daniel Lezcano <daniel.lezcano@...aro.org>,
	devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
	linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
	linux-mediatek@...ts.infradead.org, srv_heupstream@...iatek.com,
	Sascha Hauer <kernel@...gutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

Viresh Kumar <viresh.kumar@...aro.org> writes:

> On 22-10-15, 20:02, Dawei Chien wrote:
>> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
>> The power allocator governor allocates power budget to control CPU temperature.
>> 
>> Power Allocator governor is able to keep SOC temperature within a
>> defined temperature range to avoid SOC overheat and keep it's
>> performance. mt8173-cpufreq.c need to register its' own power model
>> with power allocator thermal governor, so that power allocator
>> governor can allocates suitable power budget to control CPU
>> temperature.
>> 
>> PATCH1 is base on
>> https://patchwork.kernel.org/patch/7034601/
>> 
>> PATCH2 is base on Sascha's thermal driver V9
>> https://patchwork.kernel.org/patch/7249821/
>> https://patchwork.kernel.org/patch/7249861/
>> https://patchwork.kernel.org/patch/7249891/
>> 
>> Change since V1:
>> include mt8171.h and sort header file for mt8173.dtsi
>> 
>> Change since V2:
>> Move dynamic/static power model in device tree
>> 
>> Dawei.Chien (2):
>>   thermal: mediatek: Add cpu power cooling model.
>>   arm64: dts: mt8173: Add thermal zone node for mt8173.
>
> Sorry for being extremely late in reviewing this stuff. You are
> already on v3 and I haven't reviewed it once. Mostly due to bad timing
> of my holidays and other work pressure.
>
> Now, there are few things that I feel are not properly addressed here,
> and I may be wrong:
> - Where are the bindings for static-power-points and
>   dynamic-power-coefficient. Sorry I failed to see them in this or
>   other series you mentioned.

For dynamic power, I had posted some patches[0][1][2] introducing the
binding as well as updating cooling device registration via cpufreq
driver. Now that the SCPI hwmon driver is merged, I should re-send the
remaining patches.

[0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
[1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
[3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html

> - Even then, why should we be adding another table into DT for
>   voltage/power ? And not reuse and extend the opp-v2 stuff which is
>   already mainlined now.
> - There are few issues with the code as well, but I want to see where
>   the bindings should go first. And then only discuss the code
>   further.
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