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Message-ID: <20151102161007.GI3639@ubuntu>
Date: Mon, 2 Nov 2015 21:40:07 +0530
From: Viresh Kumar <viresh.kumar@...aro.org>
To: Punit Agrawal <punit.agrawal@....com>
Cc: Dawei Chien <dawei.chien@...iatek.com>,
"Rafael J. Wysocki" <rjw@...ysocki.net>,
Rob Herring <robh+dt@...nel.org>,
Pawel Moll <pawel.moll@....com>,
Mark Rutland <mark.rutland@....com>,
Ian Campbell <ijc+devicetree@...lion.org.uk>,
Kumar Gala <galak@...eaurora.org>,
Matthias Brugger <matthias.bgg@...il.com>,
Daniel Kurtz <djkurtz@...omium.org>,
Sascha Hauer <s.hauer@...gutronix.de>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
linux-mediatek@...ts.infradead.org, srv_heupstream@...iatek.com,
Sascha Hauer <kernel@...gutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model
On 02-11-15, 15:53, Punit Agrawal wrote:
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
>
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html
> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
Sure. Just that whatever can be merged with opp-v2 should be merged.
--
viresh
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