linux-kernel - Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

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Message-ID: <20151104193645.GB14127@localhost.localdomain>
Date:	Wed, 4 Nov 2015 11:36:46 -0800
From:	Eduardo Valentin <edubezval@...il.com>
To:	Punit Agrawal <punit.agrawal@....com>
Cc:	Viresh Kumar <viresh.kumar@...aro.org>,
	Dawei Chien <dawei.chien@...iatek.com>,
	"Rafael J. Wysocki" <rjw@...ysocki.net>,
	Rob Herring <robh+dt@...nel.org>,
	Pawel Moll <pawel.moll@....com>,
	Mark Rutland <mark.rutland@....com>,
	Ian Campbell <ijc+devicetree@...lion.org.uk>,
	Kumar Gala <galak@...eaurora.org>,
	Matthias Brugger <matthias.bgg@...il.com>,
	Daniel Kurtz <djkurtz@...omium.org>,
	Sascha Hauer <s.hauer@...gutronix.de>,
	Daniel Lezcano <daniel.lezcano@...aro.org>,
	devicetree@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
	linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
	linux-mediatek@...ts.infradead.org, srv_heupstream@...iatek.com,
	Sascha Hauer <kernel@...gutronix.de>
Subject: Re: [PATCH v3 0/2] thermal: mediatek: Add cpu power cooling model

On Mon, Nov 02, 2015 at 03:53:33PM +0000, Punit Agrawal wrote:
> Viresh Kumar <viresh.kumar@...aro.org> writes:
> 
> > On 22-10-15, 20:02, Dawei Chien wrote:
> >> Use Intelligent Power Allocation (IPA) technical to add static/dynamic power model for binding CPU thermal zone.
> >> The power allocator governor allocates power budget to control CPU temperature.
> >> 
> >> Power Allocator governor is able to keep SOC temperature within a
> >> defined temperature range to avoid SOC overheat and keep it's
> >> performance. mt8173-cpufreq.c need to register its' own power model
> >> with power allocator thermal governor, so that power allocator
> >> governor can allocates suitable power budget to control CPU
> >> temperature.
> >> 
> >> PATCH1 is base on
> >> https://patchwork.kernel.org/patch/7034601/
> >> 
> >> PATCH2 is base on Sascha's thermal driver V9
> >> https://patchwork.kernel.org/patch/7249821/
> >> https://patchwork.kernel.org/patch/7249861/
> >> https://patchwork.kernel.org/patch/7249891/
> >> 
> >> Change since V1:
> >> include mt8171.h and sort header file for mt8173.dtsi
> >> 
> >> Change since V2:
> >> Move dynamic/static power model in device tree
> >> 
> >> Dawei.Chien (2):
> >>   thermal: mediatek: Add cpu power cooling model.
> >>   arm64: dts: mt8173: Add thermal zone node for mt8173.
> >
> > Sorry for being extremely late in reviewing this stuff. You are
> > already on v3 and I haven't reviewed it once. Mostly due to bad timing
> > of my holidays and other work pressure.
> >
> > Now, there are few things that I feel are not properly addressed here,
> > and I may be wrong:
> > - Where are the bindings for static-power-points and
> >   dynamic-power-coefficient. Sorry I failed to see them in this or
> >   other series you mentioned.
> 
> For dynamic power, I had posted some patches[0][1][2] introducing the
> binding as well as updating cooling device registration via cpufreq
> driver. Now that the SCPI hwmon driver is merged, I should re-send the
> remaining patches.
> 
> [0] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01020.html

Are you sure this binding is applicable only to ARM cpus?

> [1] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01022.html
> [3] http://lkml.iu.edu/hypermail/linux/kernel/1508.0/01031.html
> 
> > - Even then, why should we be adding another table into DT for
> >   voltage/power ? And not reuse and extend the opp-v2 stuff which is
> >   already mainlined now.
> > - There are few issues with the code as well, but I want to see where
> >   the bindings should go first. And then only discuss the code
> >   further.
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