linux-kernel - Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor bindings

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Message-ID: <d56428a6-ef27-4424-3ce5-4610fef3ac15@linaro.org>
Date:   Thu, 31 Aug 2017 20:24:23 +0200
From:   Daniel Lezcano <daniel.lezcano@...aro.org>
To:     Tao Wang <kevin.wangtao@...ilicon.com>, rui.zhang@...el.com,
        edubezval@...il.com, robh+dt@...nel.org, mark.rutland@....com,
        xuwei5@...ilicon.com, catalin.marinas@....com, will.deacon@....com
Cc:     leo.yan@...aro.org, kevin.wangtao@...aro.org,
        linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
        sunzhaosheng@...ilicon.com, gengyanping@...ilicon.com
Subject: Re: [PATCH v4 1/3] dt-bindings: Document the hi3660 thermal sensor
 bindings

On 29/08/2017 10:17, Tao Wang wrote:
> From: Tao Wang <kevin.wangtao@...aro.org>
> 
> This adds documentation of device tree bindings for the
> thermal sensor controller of hi3660 SoC.
> 
> Signed-off-by: Tao Wang <kevin.wangtao@...aro.org>
> ---
>  .../devicetree/bindings/thermal/hisi-tsensor.txt   | 37 ++++++++++++++++++++++
>  1 file changed, 37 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> 
> diff --git a/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> new file mode 100644
> index 0000000..4643dbe
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/hisi-tsensor.txt
> @@ -0,0 +1,37 @@
> +* Temperature Sensor on hisilicon SoC
> +
> +Hisilicon SoC supplies temperature sensor feature, each CPU cluster and G3D
> +area contains a temperture sensor. The temperture sensor produces an output
> +value which has a linear relationship with the temperture of the area.
> +

s/temperture/temperature/

> +for Hi3660,
> +sensor0 monitors the temperture of A53;
> +sensor1 monitors the temperture of A72;
> +sensor2 monitors the temperture of GPU;
> +sensor3 is a virtual sensor, which produces the maximum value of all sensors;
> +sensor4 is a virtual sensor, which produces the average value of all sensors.

I don't think we need to escribe the virtual sensors in the DT bindings.

> +** Required properties :
> +- compatible: "hisilicon,thermal-tsensor".
> +- reg: physical reg address of thermal sensor and length of memory mapped
> +  region.
> +- hisi,tsensors: number of hardware tsensors
> +- hisi,coef:	An array of integers (one signed cell) containing
> +		coefficients to turn adc value to temperture.
> +- hisi,adc-range: adc value range, minimum value is followed by maximum value.
> +- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
> +
> +Example :
> +Hi3660:
> +tsensor: tsensor@...30000 {
> +	compatible = "hisilicon,hi3660-tsensor";
> +	#address-cells = <2>;
> +	#size-cells = <2>;
> +	reg = <0x0 0xfff3001c 0x0 0x4>,
> +		<0x0 0xfff3005c 0x0 0x4>,
> +		<0x0 0xfff3009c 0x0 0x4>;
> +	hisi,tsensors = <HISI_MAX_TSENSORS>;
> +	hisi,coef = <165000 (-40000)>;
> +	hisi,adc-range = <0x74 0x39A>;

Do we really need max sensors, coef and adc range to be specified in the DT?

Can't we assume the hi3660-tsensor has 3 sensors, and hard-code the
coef, adc, in the driver itself?

Can't this binding be merged with the hisilicon-thermal.txt?

Thanks.

  -- Daniel


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