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Message-ID: <20180903094404.ih2fsqsetz6oo7ie@flea>
Date: Mon, 3 Sep 2018 11:44:04 +0200
From: Maxime Ripard <maxime.ripard@...tlin.com>
To: Philipp Rossak <embed3d@...il.com>
Cc: lee.jones@...aro.org, robh+dt@...nel.org, mark.rutland@....com,
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Subject: Re: [PATCH v3 20/30] iio: adc: sun4i-gpadc-iio: rework: device
specific suspend & resume
On Fri, Aug 31, 2018 at 02:05:59PM +0200, Philipp Rossak wrote:
>
>
> On 31.08.2018 11:09, Maxime Ripard wrote:
> > > +static int sun4i_ths_suspend(struct sun4i_gpadc_iio *info)
> > suspend is already a hook in the kernel, which hasn't the same meaning
> > than runtime_suspend (and the same applies to resume), so we'd rather
> > pick a better name. And all the functions (and the driver) use gpadc,
> > please continue to use that prefix.
>
> I agree.
> For the newer sensors (from H3) the Sensor is referenced in the datasheets
> as Thermal Sensor short THS. So I would like to use for the newer sensors
> that prefix. Is that ok?
Not really. The consistency within the driver is more important.
Maxiem
--
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com
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