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Date:   Mon, 3 Sep 2018 12:20:22 +0200
From:   Maxime Ripard <maxime.ripard@...tlin.com>
To:     Icenowy Zheng <icenowy@...c.io>
Cc:     Philipp Rossak <embed3d@...il.com>, mark.rutland@....com,
        geert+renesas@...der.be, linux-iio@...r.kernel.org,
        robh+dt@...nel.org, linux-sunxi@...glegroups.com,
        clabbe.montjoie@...il.com, pmeerw@...erw.net, lee.jones@...aro.org,
        lars@...afoo.de, quentin.schulz@...tlin.com, linux@...linux.org.uk,
        wens@...e.org, devicetree@...r.kernel.org, arnd@...db.de,
        vilhelm.gray@...il.com, broonie@...nel.org,
        linux-arm-kernel@...ts.infradead.org, rdunlap@...radead.org,
        arnaud.pouliquen@...com, linux-kernel@...r.kernel.org,
        lukas@...ner.de, knaack.h@....de, eugen.hristev@...rochip.com,
        jic23@...nel.org
Subject: Re: [PATCH v3 21/30] iio: adc: sun4i-gpadc-iio: add support for H3
 thermal sensor

On Fri, Aug 31, 2018 at 05:51:41PM +0800, Icenowy Zheng wrote:
> Personally I suggest to leave out all SID or calibration related
> patches here.
> 
> Currently we seems to be wrongly converting SID to big endian, however,
> the orgnization of the THS calibration data on H6 shows that it's
> surely little endian:
> 
> It consists a temperature value in 1/10 celsuis as unit, and some
> thermal register readout values, which are the values read out at the
> given temperature, and every value here (the temperature and the
> readout) are all half word length.
> 
> Let the temperature value be AABB, the two readout values be XXYY and
> ZZWW, the oragnization is:
> BB AA YY XX WW ZZ ** ** .
> 
> When converting the SID to big endian, it becomes:
> XX YY AA BB ** ** ZZ WW ,
> which is non-sense, and not able to do sub-word cell addressing.
> 
> Maxime, should I drop the LE2BE conversion in SID driver? (I doubt
> whether it will break compatibility.)

This is exposed to the userspace, so no.

Maxime
> 

-- 
Maxime Ripard, Bootlin
Embedded Linux and Kernel engineering
https://bootlin.com

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