linux-kernel - Re: [PATCH 00/10] perf: Multi-die/package support

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Message-ID: <20190220101521.GF32494@hirez.programming.kicks-ass.net>
Date:   Wed, 20 Feb 2019 11:15:21 +0100
From:   Peter Zijlstra <peterz@...radead.org>
To:     kan.liang@...ux.intel.com
Cc:     tglx@...utronix.de, acme@...nel.org, mingo@...hat.com,
        x86@...nel.org, linux-kernel@...r.kernel.org, len.brown@...el.com,
        jolsa@...hat.com, namhyung@...nel.org, eranian@...gle.com,
        ak@...ux.intel.com
Subject: Re: [PATCH 00/10] perf: Multi-die/package support

On Tue, Feb 19, 2019 at 12:00:01PM -0800, kan.liang@...ux.intel.com wrote:
> From: Kan Liang <kan.liang@...ux.intel.com>
> 
> Add Linux perf support for multi-die/package. The first product with
> multi-die is Xeon Cascade Lake-AP (CLX-AP).
> The code bases on the top of Len's multi-die/package support.
> https://lkml.org/lkml/2019/2/18/1534

*sigh*, don't use lkml.org links.

We have a perfectly good canonical form:

  https://lkml.kernel.org/r/20190219034013.4147-1-lenb@kernel.org

which has the added benefit of including the Message-Id such that I can
easily find the email in my local archive.

And since Len forgot to Cc me on those, I suppose I'll have to go dig
them out to make sense of these here patches.