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Date:   Wed, 15 May 2019 18:38:49 +0200
From:   Ingo Molnar <mingo@...nel.org>
To:     Peter Zijlstra <peterz@...radead.org>
Cc:     Len Brown <lenb@...nel.org>, x86@...nel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH 0/19] v6 multi-die/package topology support


* Peter Zijlstra <peterz@...radead.org> wrote:

> On Mon, May 13, 2019 at 01:58:44PM -0400, Len Brown wrote:
> > 
> > This patch series does 4 things.
> > 
> > 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
> > 
> > 2. Export multi-die topology inside the kernel
> > 
> > 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
> >    the difference between die and package-scope MSR.
> > 
> > 4. Export multi-die topology to user-space via sysfs
> > 
> > These changes should have no impact on cache topology,
> > NUMA topology, Linux scheduler, or system performance.
> > 
> > These topology changes primarily impact parts of the kernel
> > and some applications that care about package MSR scope.
> > Also, some software is licensed per package, and other tools,
> > such as benchmark reporting software sometimes cares about packages.
> 
> I still think having a 'rapl package' be a 'die' is weird, but if that's
> the way it is specified in the SDM then so be it.
> 
> Acked-by: Peter Zijlstra (Intel) <peterz@...radead.org>

Thanks Peter, I'll queue it up in the next couple of days, for a 
tentative v5.3 merge.

Thanks,

	Ingo

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