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Message-ID: <20190522204431.GA18891@gmail.com>
Date: Wed, 22 May 2019 22:44:31 +0200
From: Ingo Molnar <mingo@...nel.org>
To: Len Brown <lenb@...nel.org>
Cc: x86@...nel.org, linux-kernel@...r.kernel.org,
Thomas Gleixner <tglx@...utronix.de>
Subject: Re: [PATCH 0/19] v6 multi-die/package topology support
* Len Brown <lenb@...nel.org> wrote:
>
> This patch series does 4 things.
>
> 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
>
> 2. Export multi-die topology inside the kernel
>
> 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
> the difference between die and package-scope MSR.
>
> 4. Export multi-die topology to user-space via sysfs
>
> These changes should have no impact on cache topology,
> NUMA topology, Linux scheduler, or system performance.
Thank you Len:
Reviewed-by: Ingo Molnar <mingo@...nel.org>
Ingo
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