linux-kernel - Re: [PATCH 0/19] v6 multi-die/package topology support

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Date:   Wed, 22 May 2019 22:44:31 +0200
From:   Ingo Molnar <mingo@...nel.org>
To:     Len Brown <lenb@...nel.org>
Cc:     x86@...nel.org, linux-kernel@...r.kernel.org,
        Thomas Gleixner <tglx@...utronix.de>
Subject: Re: [PATCH 0/19] v6 multi-die/package topology support


* Len Brown <lenb@...nel.org> wrote:

> 
> This patch series does 4 things.
> 
> 1. Parse the new CPUID.1F leaf to discover multi-die/package topology
> 
> 2. Export multi-die topology inside the kernel
> 
> 3. Update 4 places (coretemp, pkgtemp, rapl, perf) that that need to know
>    the difference between die and package-scope MSR.
> 
> 4. Export multi-die topology to user-space via sysfs
> 
> These changes should have no impact on cache topology,
> NUMA topology, Linux scheduler, or system performance.

Thank you Len:

Reviewed-by: Ingo Molnar <mingo@...nel.org>

	Ingo