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Message-ID: <5188064.YWmxIpmbGp@phil>
Date:   Fri, 14 Jun 2019 11:35:25 +0200
From:   Heiko Stuebner <heiko@...ech.de>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     linux-kernel@...r.kernel.org, edubezval@...il.com,
        manivannan.sadhasivam@...aro.org, Rob Herring <robh+dt@...nel.org>,
        Mark Rutland <mark.rutland@....com>,
        Matthias Brugger <matthias.bgg@...il.com>,
        Philipp Tomsich <philipp.tomsich@...obroma-systems.com>,
        Christoph Muellner <christoph.muellner@...obroma-systems.com>,
        Viresh Kumar <viresh.kumar@...aro.org>,
        Enric Balletbo i Serra <enric.balletbo@...labora.com>,
        Emil Renner Berthing <kernel@...il.dk>,
        Randy Li <ayaka@...lik.info>,
        Tony Xie <tony.xie@...k-chips.com>,
        Vicente Bergas <vicencb@...il.com>,
        Klaus Goger <klaus.goger@...obroma-systems.com>,
        "open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS" 
        <devicetree@...r.kernel.org>,
        "moderated list:ARM/Rockchip SoC support" 
        <linux-arm-kernel@...ts.infradead.org>,
        "open list:ARM/Rockchip SoC support" 
        <linux-rockchip@...ts.infradead.org>, dianders@...omium.org,
        robin.murphy@....com
Subject: Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones conflict in rk3399.dtsi

Hi Daniel,

Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
> Currently the common thermal zones definitions for the rk3399 assumes
> multiple thermal zones are supported by the governors. This is not the
> case and each thermal zone has its own governor instance acting
> individually without collaboration with other governors.
> 
> As the cooling device for the CPU and the GPU thermal zones is the
> same, each governors take different decisions for the same cooling
> device leading to conflicting instructions and an erratic behavior.
> 
> As the cooling-maps is about to become an optional property, let's
> remove the cpu cooling device map from the GPU thermal zone.
> 
> Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>
> ---
>  arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>  1 file changed, 9 deletions(-)
> 
> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> index 196ac9b78076..e1357e0f60f7 100644
> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
> @@ -821,15 +821,6 @@
>  					type = "critical";
>  				};
>  			};
> -
> -			cooling-maps {
> -				map0 {
> -					trip = <&gpu_alert0>;
> -					cooling-device =
> -						<&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
> -						<&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
> -				};
> -			};
>  		};
>  	};

my knowledge of the thermal framework is not that big, but what about the
rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?


Heiko


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