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Message-ID: <3ee47d34-bf71-9e53-9387-7407865d3110@arm.com>
Date: Fri, 14 Jun 2019 11:09:27 +0100
From: Robin Murphy <robin.murphy@....com>
To: Heiko Stuebner <heiko@...ech.de>,
Daniel Lezcano <daniel.lezcano@...aro.org>
Cc: linux-kernel@...r.kernel.org, edubezval@...il.com,
manivannan.sadhasivam@...aro.org, Rob Herring <robh+dt@...nel.org>,
Mark Rutland <mark.rutland@....com>,
Matthias Brugger <matthias.bgg@...il.com>,
Philipp Tomsich <philipp.tomsich@...obroma-systems.com>,
Christoph Muellner <christoph.muellner@...obroma-systems.com>,
Viresh Kumar <viresh.kumar@...aro.org>,
Enric Balletbo i Serra <enric.balletbo@...labora.com>,
Emil Renner Berthing <kernel@...il.dk>,
Randy Li <ayaka@...lik.info>,
Tony Xie <tony.xie@...k-chips.com>,
Vicente Bergas <vicencb@...il.com>,
Klaus Goger <klaus.goger@...obroma-systems.com>,
"open list:OPEN FIRMWARE AND FLATTENED DEVICE TREE BINDINGS"
<devicetree@...r.kernel.org>,
"moderated list:ARM/Rockchip SoC support"
<linux-arm-kernel@...ts.infradead.org>,
"open list:ARM/Rockchip SoC support"
<linux-rockchip@...ts.infradead.org>, dianders@...omium.org
Subject: Re: [PATCH 1/2] arm64: dts: rockchip: Fix multiple thermal zones
conflict in rk3399.dtsi
On 14/06/2019 10:35, Heiko Stuebner wrote:
> Hi Daniel,
>
> Am Dienstag, 4. Juni 2019, 18:57:57 CEST schrieb Daniel Lezcano:
>> Currently the common thermal zones definitions for the rk3399 assumes
>> multiple thermal zones are supported by the governors. This is not the
>> case and each thermal zone has its own governor instance acting
>> individually without collaboration with other governors.
>>
>> As the cooling device for the CPU and the GPU thermal zones is the
>> same, each governors take different decisions for the same cooling
>> device leading to conflicting instructions and an erratic behavior.
>>
>> As the cooling-maps is about to become an optional property, let's
>> remove the cpu cooling device map from the GPU thermal zone.
>>
>> Signed-off-by: Daniel Lezcano <daniel.lezcano@...aro.org>
>> ---
>> arch/arm64/boot/dts/rockchip/rk3399.dtsi | 9 ---------
>> 1 file changed, 9 deletions(-)
>>
>> diff --git a/arch/arm64/boot/dts/rockchip/rk3399.dtsi b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> index 196ac9b78076..e1357e0f60f7 100644
>> --- a/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> +++ b/arch/arm64/boot/dts/rockchip/rk3399.dtsi
>> @@ -821,15 +821,6 @@
>> type = "critical";
>> };
>> };
>> -
>> - cooling-maps {
>> - map0 {
>> - trip = <&gpu_alert0>;
>> - cooling-device =
>> - <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>,
>> - <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
>> - };
>> - };
>> };
>> };
>
> my knowledge of the thermal framework is not that big, but what about the
> rk3399-devices which further detail the cooling-maps like rk3399-gru-kevin
> and the rk3399-nanopc-t4 with its fan-handling in the cooling-maps?
FWIW, my knowledge of thermal is probably even less :)
For NanoPC-T4 I think I more or less just took Odroid-XU3/4 as the best
pwm-fan example and adapted that into the existing RK3399 zones in the
manner which seemed most logical to my interpretation - if what was
there wasn't right to begin with, then I may well have done that wrong too.
Robin.
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