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Message-ID: <20190815182430.GD14360@kozik-lap>
Date: Thu, 15 Aug 2019 20:24:30 +0200
From: Krzysztof Kozlowski <krzk@...nel.org>
To: Sylwester Nawrocki <s.nawrocki@...sung.com>
Cc: robh+dt@...nel.org, vireshk@...nel.org, devicetree@...r.kernel.org,
kgene@...nel.org, pankaj.dubey@...sung.com,
linux-samsung-soc@...r.kernel.org,
linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
linux-pm@...r.kernel.org, b.zolnierkie@...sung.com,
m.szyprowski@...sung.com
Subject: Re: [PATCH v3 7/9] soc: samsung: Update the CHIP ID DT binding
documentation
On Tue, Aug 13, 2019 at 05:08:25PM +0200, Sylwester Nawrocki wrote:
> This patch adds documentation of a new optional "samsung,asv-bin"
> property in the chipid device node and documents requirement of
> "syscon" compatible string. These additions are needed to support
> Exynos ASV (Adaptive Supply Voltage) feature.
>
> Signed-off-by: Sylwester Nawrocki <s.nawrocki@...sung.com>
> ---
> Changes since v2:
> - none
>
> Changes since v1 (RFC):
Title should match bindings, so:
dt-bindings: samsung:
Also please put it before the driver change using these bindings.
Best regards,
Krzysztof
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