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Message-ID: <20190815182430.GD14360@kozik-lap>
Date:   Thu, 15 Aug 2019 20:24:30 +0200
From:   Krzysztof Kozlowski <krzk@...nel.org>
To:     Sylwester Nawrocki <s.nawrocki@...sung.com>
Cc:     robh+dt@...nel.org, vireshk@...nel.org, devicetree@...r.kernel.org,
        kgene@...nel.org, pankaj.dubey@...sung.com,
        linux-samsung-soc@...r.kernel.org,
        linux-arm-kernel@...ts.infradead.org, linux-kernel@...r.kernel.org,
        linux-pm@...r.kernel.org, b.zolnierkie@...sung.com,
        m.szyprowski@...sung.com
Subject: Re: [PATCH v3 7/9] soc: samsung: Update the CHIP ID DT binding
 documentation

On Tue, Aug 13, 2019 at 05:08:25PM +0200, Sylwester Nawrocki wrote:
> This patch adds documentation of a new optional "samsung,asv-bin"
> property in the chipid device node and documents requirement of
> "syscon" compatible string.  These additions are needed to support
> Exynos ASV (Adaptive Supply Voltage) feature.
> 
> Signed-off-by: Sylwester Nawrocki <s.nawrocki@...sung.com>
> ---
> Changes since v2:
>  - none
> 
> Changes since v1 (RFC):

Title should match bindings, so:
dt-bindings: samsung:

Also please put it before the driver change using these bindings.

Best regards,
Krzysztof

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