linux-kernel - RE: [PATCH v4 26/34] dt-bindings: misc: intel_tsens: Add tsens thermal bindings documentation

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Message-ID: <BL0PR11MB323427EEAE8176C0033178A1E2B59@BL0PR11MB3234.namprd11.prod.outlook.com>
Date:   Tue, 2 Feb 2021 08:47:46 +0000
From:   "C, Udhayakumar" <udhayakumar.c@...el.com>
To:     Rob Herring <robh@...nel.org>,
        "mgross@...ux.intel.com" <mgross@...ux.intel.com>
CC:     "jassisinghbrar@...il.com" <jassisinghbrar@...il.com>,
        "corbet@....net" <corbet@....net>,
        "dragan.cvetic@...inx.com" <dragan.cvetic@...inx.com>,
        "palmerdabbelt@...gle.com" <palmerdabbelt@...gle.com>,
        "devicetree@...r.kernel.org" <devicetree@...r.kernel.org>,
        "linux-kernel@...r.kernel.org" <linux-kernel@...r.kernel.org>,
        "damien.lemoal@....com" <damien.lemoal@....com>,
        "shawnguo@...nel.org" <shawnguo@...nel.org>,
        "paul.walmsley@...ive.com" <paul.walmsley@...ive.com>,
        "arnd@...db.de" <arnd@...db.de>,
        "robh+dt@...nel.org" <robh+dt@...nel.org>,
        "peng.fan@....com" <peng.fan@....com>, "bp@...e.de" <bp@...e.de>,
        "markgross@...nel.org" <markgross@...nel.org>,
        "gregkh@...uxfoundation.org" <gregkh@...uxfoundation.org>
Subject: RE: [PATCH v4 26/34] dt-bindings: misc: intel_tsens: Add tsens
 thermal bindings documentation

> On Fri, 29 Jan 2021 18:21:16 -0800, mgross@...ux.intel.com wrote:
> > From: "C, Udhayakumar" <udhayakumar.c@...el.com>
> >
> > Add device tree bindings for local host thermal sensors Intel Edge.AI
> > Computer Vision platforms.
> >
> > The tsens module enables reading of on chip sensors present in the
> > Intel Bay series SoC. In the tsens module various junction temperature
> > and SoC temperature are reported using thermal subsystem and i2c
> > subsystem.
> >
> > Temperature data reported using thermal subsystem will be used for
> > various cooling agents such as DVFS, fan control and shutdown the
> > system in case of critical temperature.
> >
> > Temperature data reported using i2c subsytem will be used by platform
> > manageability software running in remote host.
> >
> > Cc: Rob Herring <robh+dt@...nel.org>
> > Cc: devicetree@...r.kernel.org
> > Acked-by: mark gross <mgross@...ux.intel.com>
> > Signed-off-by: C Udhayakumar <udhayakumar.c@...el.com>
> > Signed-off-by: Mark Gross <mgross@...ux.intel.com>
> > ---
> >  .../bindings/misc/intel,intel-tsens.yaml      | 118 ++++++++++++++++++
> >  1 file changed, 118 insertions(+)
> >  create mode 100644
> > Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml
> >
> 
> My bot found errors running 'make dt_binding_check' on your patch:
> 
> yamllint warnings/errors:
> 
> dtschema/dtc warnings/errors:
> /builds/robherring/linux-dt-
> review/Documentation/devicetree/bindings/misc/intel,intel-
> tsens.example.dt.yaml: example-0: tsens@...60000:reg:0: [0, 539361280, 0,
> 256] is too long
> 	From schema: /usr/local/lib/python3.8/dist-
> packages/dtschema/schemas/reg.yaml
> 
> See https://patchwork.ozlabs.org/patch/1433609
> 
This lint warning is due to missing address-cells and size-cells fields.

make dt_binding_check dtbs_check DT_SCHEMA_FILES=Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml 
  CHKDT   Documentation/devicetree/bindings/misc/intel,intel-tsens.yaml
  DTC     Documentation/devicetree/bindings/misc/intel,intel-tsens.example.dt.yaml
  CHECK   Documentation/devicetree/bindings/misc/intel,intel-tsens.example.dt.yaml

Will update the fix in next patch version.
---
Thanks,
Udhay

> This check can fail if there are any dependencies. The base for a patch series
> is generally the most recent rc1.
> 
> If you already ran 'make dt_binding_check' and didn't see the above error(s),
> then make sure 'yamllint' is installed and dt-schema is up to
> date:
> 
> pip3 install dtschema --upgrade
> 
> Please check and re-submit.