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Date: Fri, 13 May 2022 19:56:17 +0200
From: "Rafael J. Wysocki" <rafael@...nel.org>
To: Daniel Lezcano <daniel.lezcano@...aro.org>
Cc: Daniel Lezcano <daniel.lezcano@...exp.org>,
"Rafael J. Wysocki" <rafael@...nel.org>,
Kevin Hilman <khilman@...libre.com>,
Alexandre Bailon <abailon@...libre.com>,
Linux PM <linux-pm@...r.kernel.org>,
Linux Kernel Mailing List <linux-kernel@...r.kernel.org>
Subject: Re: [PATCH v2 00/14] thermal OF rework
On Fri, May 13, 2022 at 7:23 PM Daniel Lezcano
<daniel.lezcano@...aro.org> wrote:
>
>
> Hi Rafael,
>
> if you are ok with this series, I'll pick it up.
>
> Is that ok ?
Give me some more time to look at it, please.
I'll respond in the first half of next week.
> On 07/05/2022 14:54, Daniel Lezcano wrote:
> > The thermal framework initialization with the device tree appears to
> > be complicated and hard to make it to evolve.
> >
> > It contains duplication of almost the same thermal generic structures
> > and has an assymetric initialization making hard any kind of serious
> > changes for more complex features. One of them is the multiple sensors
> > support per thermal zone.
> >
> > In order to set the scene for the aforementioned feature with generic
> > code, we need to cleanup and rework the device tree initialization.
> >
> > However this rework is not obvious because of the multiple components
> > entering in the composition of a thermal zone and being initialized at
> > different moments. For instance, a cooling device can be initialized
> > before a sensor, so the thermal zones must exist before the cooling
> > device as well as the sensor. This asynchonous initialization forces
> > the thermal zone to be created with fake ops because they are
> > mandotory and build a list of cooling devices which is used to lookup
> > afterwards when the cooling device driver is registering itself.
> >
> > As there could be a large number of changes, this first series provide
> > some steps forward for a simpler device tree initialization.
> >
> > Changelog:
> > - V2:
> > - Drop patch 1/15 which contains too many changes for a simple
> > structure renaming. This could be addressed in a separate series as
> > it is not necessary for the OF rework
> >
> > - Fixed of_node_put with gchild not initialized as reported by
> > kbuild and Dan Carpenter
> >
> > - V1:
> > - Initial post
> >
> > Daniel Lezcano (14):
> > thermal/core: Change thermal_zone_ops to thermal_sensor_ops
> > thermal/core: Add a thermal sensor structure in the thermal zone
> > thermal/core: Remove duplicate information when an error occurs
> > thermal/of: Replace device node match with device node search
> > thermal/of: Remove the device node pointer for thermal_trip
> > thermal/of: Move thermal_trip structure to thermal.h
> > thermal/core: Remove unneeded EXPORT_SYMBOLS
> > thermal/core: Move thermal_set_delay_jiffies to static
> > thermal/core: Rename trips to ntrips
> > thermal/core: Add thermal_trip in thermal_zone
> > thermal/core: Register with the trip points
> > thermal/of: Store the trips in the thermal zone
> > thermal/of: Use thermal trips stored in the thermal zone
> > thermal/of: Initialize trip points separately
> >
> > .../driver-api/thermal/sysfs-api.rst | 2 +-
> > drivers/acpi/thermal.c | 6 +-
> > .../ethernet/chelsio/cxgb4/cxgb4_thermal.c | 2 +-
> > .../ethernet/mellanox/mlxsw/core_thermal.c | 6 +-
> > drivers/net/wireless/intel/iwlwifi/mvm/tt.c | 2 +-
> > drivers/platform/x86/acerhdf.c | 2 +-
> > drivers/power/supply/power_supply_core.c | 2 +-
> > drivers/thermal/armada_thermal.c | 2 +-
> > drivers/thermal/broadcom/bcm2835_thermal.c | 2 +-
> > drivers/thermal/da9062-thermal.c | 2 +-
> > drivers/thermal/dove_thermal.c | 2 +-
> > drivers/thermal/gov_bang_bang.c | 6 +-
> > drivers/thermal/gov_fair_share.c | 10 +-
> > drivers/thermal/gov_power_allocator.c | 22 +-
> > drivers/thermal/gov_step_wise.c | 4 +-
> > drivers/thermal/imx_thermal.c | 2 +-
> > .../intel/int340x_thermal/int3400_thermal.c | 2 +-
> > .../int340x_thermal/int340x_thermal_zone.c | 6 +-
> > .../int340x_thermal/int340x_thermal_zone.h | 4 +-
> > .../processor_thermal_device.c | 4 +-
> > .../processor_thermal_device_pci.c | 2 +-
> > drivers/thermal/intel/intel_pch_thermal.c | 2 +-
> > .../thermal/intel/intel_quark_dts_thermal.c | 2 +-
> > drivers/thermal/intel/intel_soc_dts_iosf.c | 2 +-
> > drivers/thermal/intel/x86_pkg_temp_thermal.c | 2 +-
> > drivers/thermal/kirkwood_thermal.c | 2 +-
> > drivers/thermal/rcar_gen3_thermal.c | 6 +-
> > drivers/thermal/rcar_thermal.c | 4 +-
> > drivers/thermal/samsung/exynos_tmu.c | 6 +-
> > drivers/thermal/spear_thermal.c | 2 +-
> > drivers/thermal/st/st_thermal.c | 2 +-
> > drivers/thermal/tegra/soctherm.c | 10 +-
> > drivers/thermal/tegra/tegra30-tsensor.c | 6 +-
> > drivers/thermal/thermal_core.c | 102 ++++----
> > drivers/thermal/thermal_core.h | 25 +-
> > drivers/thermal/thermal_helpers.c | 35 ++-
> > drivers/thermal/thermal_hwmon.c | 4 +-
> > drivers/thermal/thermal_netlink.c | 10 +-
> > drivers/thermal/thermal_of.c | 221 ++++++++++--------
> > drivers/thermal/thermal_sysfs.c | 62 ++---
> > include/linux/thermal.h | 34 ++-
> > 41 files changed, 341 insertions(+), 290 deletions(-)
> >
>
>
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