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Message-ID: <CAEnQRZB19WxVYxabOdN3ee+pp9cbwgY7p=k+6P1BqONCEJjjnQ@mail.gmail.com>
Date: Thu, 18 Aug 2022 10:04:55 +0300
From: Daniel Baluta <daniel.baluta@...il.com>
To: Shengjiu Wang <shengjiu.wang@....com>
Cc: pierre-louis.bossart@...ux.intel.com, lgirdwood@...il.com,
peter.ujfalusi@...ux.intel.com, yung-chuan.liao@...ux.intel.com,
ranjani.sridharan@...ux.intel.com, kai.vehmanen@...ux.intel.com,
daniel.baluta@....com, broonie@...nel.org, perex@...ex.cz,
tiwai@...e.com, shawnguo@...nel.org, s.hauer@...gutronix.de,
kernel@...gutronix.de, festevam@...il.com, linux-imx@....com,
robh+dt@...nel.org, krzysztof.kozlowski+dt@...aro.org,
devicetree@...r.kernel.org, alsa-devel@...a-project.org,
shengjiu.wang@...il.com, linux-kernel@...r.kernel.org,
linux-arm-kernel@...ts.infradead.org,
sound-open-firmware@...a-project.org
Subject: Re: [Sound-open-firmware] [RESEND PATCH v2 2/2] ASoC: SOF: imx: Add
i.MX8ULP HW support
On Thu, Aug 18, 2022 at 5:12 AM Shengjiu Wang <shengjiu.wang@....com> wrote:
>
> From: Zhang Peng <peng.zhang_8@....com>
>
> This adds skeleton support for the audio DSP hardware found on
> NXP i.MX8ULP platform.
>
> On i.MX8ULP resources (clocks, power, etc) are managed by the
> System Integration Module in LPAV domain and XRDC which is handled
> by arm trusted firmware.
>
> Signed-off-by: Zhang Peng <peng.zhang_8@....com>
> Signed-off-by: Shengjiu Wang <shengjiu.wang@....com>
Reviewed-by: Daniel Baluta <daniel.baluta@....com>
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