linux-kernel - Re: [PATCH] dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7

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Message-ID: <20220830162551.GA1514331-robh@kernel.org>
Date:   Tue, 30 Aug 2022 11:25:51 -0500
From:   Rob Herring <robh@...nel.org>
To:     Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
Cc:     Zhang Rui <rui.zhang@...el.com>, linux-pm@...r.kernel.org,
        linux-kernel@...r.kernel.org, Amit Kucheria <amitk@...nel.org>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Rob Herring <robh+dt@...nel.org>,
        Konrad Dybcio <konrad.dybcio@...ainline.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Dmitry Baryshkov <dmitry.baryshkov@...aro.org>,
        linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        Andy Gross <agross@...nel.org>,
        Bjorn Andersson <bjorn.andersson@...aro.org>
Subject: Re: [PATCH] dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7

On Sun, 28 Aug 2022 11:10:22 +0300, Krzysztof Kozlowski wrote:
> The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
> Qualcomm PMIC Thermal Monitoring ADC.  Based on downstream sources, the
> new compatible for TM7 differs from older TM5 by allowing configuring
> per sensor decimation, time measurement and number of sample averaging -
> unlike one configuration per entire device.  This was not reflected in
> the bindings, therefore comment the new compatible as incomplete as it
> might change and its ABI is no stable.
> 
> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Acked-by: Rob Herring <robh@...nel.org>