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Message-ID: <b70df37b-e803-acca-e7e1-5b4526e76776@linaro.org>
Date: Mon, 19 Sep 2022 13:53:08 +0200
From: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To: Andy Gross <agross@...nel.org>,
Bjorn Andersson <bjorn.andersson@...aro.org>,
Konrad Dybcio <konrad.dybcio@...ainline.org>,
"Rafael J. Wysocki" <rafael@...nel.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
Amit Kucheria <amitk@...nel.org>,
Zhang Rui <rui.zhang@...el.com>,
Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
Dmitry Baryshkov <dmitry.baryshkov@...aro.org>,
linux-arm-msm@...r.kernel.org, linux-pm@...r.kernel.org,
devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH] dt-bindings: thermal: qcom-spmi-adc-tm5: add qcom,adc-tm7
On 28/08/2022 10:10, Krzysztof Kozlowski wrote:
> The qcom,adc-tm7 compatible is already used in PMK8350 so add it to the
> Qualcomm PMIC Thermal Monitoring ADC. Based on downstream sources, the
> new compatible for TM7 differs from older TM5 by allowing configuring
> per sensor decimation, time measurement and number of sample averaging -
> unlike one configuration per entire device. This was not reflected in
> the bindings, therefore comment the new compatible as incomplete as it
> might change and its ABI is no stable.
>
> Signed-off-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> ---
> Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml | 1 +
> 1 file changed, 1 insertion(+)
Bjorn, Daniel,
Anyone picking this patch?
Best regards,
Krzysztof
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