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Message-ID: <3197889.aeNJFYEL58@diego>
Date: Fri, 21 Oct 2022 21:13:02 +0200
From: Heiko Stübner <heiko@...ech.de>
To: "Rafael J. Wysocki" <rafael@...nel.org>,
Daniel Lezcano <daniel.lezcano@...aro.org>,
Amit Kucheria <amitk@...nel.org>,
Zhang Rui <rui.zhang@...el.com>,
Sebastian Reichel <sebastian.reichel@...labora.com>
Cc: Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
linux-pm@...r.kernel.org, linux-rockchip@...ts.infradead.org,
devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
Sebastian Reichel <sebastian.reichel@...labora.com>,
kernel@...labora.com
Subject: Re: [PATCH 2/2] dt-bindings: rockchip-thermal: Support the RK3588 SoC compatible
Am Freitag, 21. Oktober 2022, 19:47:21 CEST schrieb Sebastian Reichel:
> Add a new compatible for the thermal sensor device on RK3588 SoCs.
>
> Signed-off-by: Sebastian Reichel <sebastian.reichel@...labora.com>
Reviewed-by: Heiko Stuebner <heiko@...ech.de>
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