linux-kernel - Re: [PATCH v2 05/11] dt-bindings: thermal: k3-j72xx: elaborate on binding description

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Date:   Wed, 26 Oct 2022 10:54:43 -0400
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Bryan Brattlof <bb@...com>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        Amit Kucheria <amitk@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Nishanth Menon <nm@...com>,
        Vignesh Raghavendra <vigneshr@...com>,
        Tero Kristo <kristo@...nel.org>
Cc:     Keerthy <j-keerthy@...com>, Linux PM <linux-pm@...r.kernel.org>,
        Device Trees <devicetree@...r.kernel.org>,
        LKML <linux-kernel@...r.kernel.org>,
        LKML ARM <linux-arm-kernel@...ts.infradead.org>
Subject: Re: [PATCH v2 05/11] dt-bindings: thermal: k3-j72xx: elaborate on
 binding description

On 25/10/2022 15:15, Bryan Brattlof wrote:
> Elaborate on the function of this device node as well as some of the
> properties this node uses.
> 
> Signed-off-by: Bryan Brattlof <bb@...com>
> ---


Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>

Best regards,
Krzysztof