linux-kernel - Re: [PATCH v2 02/12] dt-bindings: thermal: tsens: Add SM6115 compatible

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Message-ID: <166992359520.1215696.1988935137698769756.robh@kernel.org>
Date:   Thu, 1 Dec 2022 13:40:26 -0600
From:   Rob Herring <robh@...nel.org>
To:     Adam Skladowski <a39.skl@...il.com>
Cc:     Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        devicetree@...r.kernel.org,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>,
        Abhinav Kumar <quic_abhinavk@...cinc.com>,
        David Airlie <airlied@...il.com>, linux-kernel@...r.kernel.org,
        phone-devel@...r.kernel.org, Rob Herring <robh+dt@...nel.org>,
        Daniel Vetter <daniel@...ll.ch>,
        ~postmarketos/upstreaming@...ts.sr.ht,
        Amit Kucheria <amitk@...nel.org>,
        Daniel Lezcano <daniel.lezcano@...aro.org>,
        linux-pm@...r.kernel.org, Sean Paul <sean@...rly.run>,
        "Rafael J. Wysocki" <rafael@...nel.org>,
        Bjorn Andersson <andersson@...nel.org>,
        Rob Clark <robdclark@...il.com>,
        Dmitry Baryshkov <dmitry.baryshkov@...aro.org>,
        linux-arm-msm@...r.kernel.org, Andy Gross <agross@...nel.org>,
        Zhang Rui <rui.zhang@...el.com>,
        Thara Gopinath <thara.gopinath@...il.com>,
        Konrad Dybcio <konrad.dybcio@...aro.org>,
        Loic Poulain <loic.poulain@...aro.org>,
        dri-devel@...ts.freedesktop.org, freedreno@...ts.freedesktop.org
Subject: Re: [PATCH v2 02/12] dt-bindings: thermal: tsens: Add SM6115
 compatible

On Wed, 30 Nov 2022 21:09:40 +0100, Adam Skladowski wrote:
> Document compatible for tsens on Qualcomm SM6115 platform
> according to downstream dts it ship v2.4 of IP
> 
> Signed-off-by: Adam Skladowski <a39.skl@...il.com>
> Acked-by: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
>  1 file changed, 1 insertion(+)
> 

Since Daniel is out, applied, thanks!