linux-kernel - Re: [PATCH v3 0/6] Thermal zone device structure encapsulation

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Message-ID: <CAJZ5v0gb=wcmYPufWrJDkPoBKKJhZQHP9mJtKoRps1EV470ONw@mail.gmail.com>
Date:   Tue, 18 Apr 2023 15:51:59 +0200
From:   "Rafael J. Wysocki" <rafael@...nel.org>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     rafael@...nel.org, rui.zhang@...el.com,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org
Subject: Re: [PATCH v3 0/6] Thermal zone device structure encapsulation

On Mon, Apr 17, 2023 at 3:17 PM Daniel Lezcano
<daniel.lezcano@...aro.org> wrote:
>
>
> Hi Rafael,
>
> I think I addressed your comments from V2.
>
> Is it fine if I merge this series in the thermal/bleeding-branch ?

This series is mostly Intel thermal material, so I'd prefer to take it
via thermal-intel when ready.

Thanks!