linux-kernel - Re: [PATCH v3 1/2] dt-bindings: hwmon: add MAX31827

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Date:   Thu, 27 Apr 2023 11:56:57 -0500
From:   Rob Herring <robh@...nel.org>
To:     Daniel Matyas <daniel.matyas@...log.com>
Cc:     devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        Jean Delvare <jdelvare@...e.com>,
        Jonathan Corbet <corbet@....net>, linux-hwmon@...r.kernel.org,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Rob Herring <robh+dt@...nel.org>,
        Guenter Roeck <linux@...ck-us.net>, linux-doc@...r.kernel.org
Subject: Re: [PATCH v3 1/2] dt-bindings: hwmon: add MAX31827


On Wed, 26 Apr 2023 15:40:45 +0300, Daniel Matyas wrote:
> MAX31827 is a low-power temperature switch with I2C interface.
> 
> The device is a ±1°C accuracy from -40°C to +125°C
> (12 bits) local temperature switch and sensor with I2C/SM-
> Bus interface. The combination of small 6-bump wafer-lev-
> el package (WLP) and high accuracy makes this temper-
> ature sensor/switch ideal for a wide range of applications.
> 
> Signed-off-by: Daniel Matyas <daniel.matyas@...log.com>
> ---
>  .../bindings/hwmon/adi,max31827.yaml          | 54 +++++++++++++++++++
>  MAINTAINERS                                   |  7 +++
>  2 files changed, 61 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/hwmon/adi,max31827.yaml
> 

Reviewed-by: Rob Herring <robh@...nel.org>