linux-kernel - Re: [GIT PULL] thermal for v6.4-rc1 #3

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Date:   Thu, 27 Apr 2023 18:56:56 +0200
From:   "Rafael J. Wysocki" <rafael@...nel.org>
To:     Daniel Lezcano <daniel.lezcano@...aro.org>
Cc:     "Rafael J. Wysocki" <rafael@...nel.org>,
        Stefan Wahren <stefan.wahren@...e.com>,
        Marijn Suijten <marijn.suijten@...ainline.org>,
        Chenggang Wang <wangchenggang@...o.com>,
        AngeloGioacchino Del Regno 
        <angelogioacchino.delregno@...labora.com>,
        Kang Chen <void0red@...t.edu.cn>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>,
        Linux Kernel Mailing List <linux-kernel@...r.kernel.org>,
        Linux PM mailing list <linux-pm@...r.kernel.org>
Subject: Re: [GIT PULL] thermal for v6.4-rc1 #3

On Wed, Apr 26, 2023 at 11:27 AM Daniel Lezcano
<daniel.lezcano@...aro.org> wrote:
>
>
> Hi Rafael,
>
> can you consider pulling these changes ? They have been in linux-next
> since several days and they fix some minor issues, except one of them
> which is an urgent one for Mediatek.
>
> The following changes since commit 5bc6b1df65c87f8dd7d0afe494a2c0b9d5c73140:
>
>    thermal: intel: int340x: Add DLVR support for RFIM control
> (2023-04-18 15:24:40 +0200)
>
> are available in the Git repository at:
>
>
> ssh://git@...olite.kernel.org/pub/scm/linux/kernel/git/thermal/linux.git
> tags/thermal-v6.4-rc1-3
>
> for you to fetch changes up to 2afa82d1fc648c8d4c2ef9e876626abb1089f9ab:
>
>    dt-bindings: thermal: qcom-tsens: Correct unit address (2023-04-26
> 10:38:35 +0200)
>
> ----------------------------------------------------------------
> - Add compatible strings DT bindings for imx6sll and imx6ul to fix
>    dtbs check warning (Stefan Wahren)
>
> - Update the example in the DT bindings to reflect changes with the
>    ADC node name for QCom TM and TM5 (Marijn Suijten)
>
> - Fix the comments for the cpuidle_cooling_register() function to
>    match the function prototype (Chenggang Wang)
>
> - Fix inconsistent temperature read and some Mediatek variant board
>    reboot by reverting a change and handling the temperature
>    differently (AngeloGioacchino Del Regno)
>
> - Fix a memory leak in the initialization error path for the Mediatek
>    driver (Kang Chen)
>
> - Use of_address_to_resource() in the Mediatek driver (Rob Herring)
>
> - Fix unit address in the QCom tsens driver DT bindings (Krzysztof
>    Kozlowski)
>
> ----------------------------------------------------------------
> AngeloGioacchino Del Regno (2):
>        Revert "thermal/drivers/mediatek: Add delay after thermal banks
> initialization"
>        thermal/drivers/mediatek: Add temperature constraints to validate
> read
>
> Chenggang Wang (1):
>        thermal/drivers/cpuidle_cooling: Delete unmatched comments
>
> Kang Chen (2):
>        thermal/drivers/mediatek: Use devm_of_iomap to avoid resource
> leak in mtk_thermal_probe
>        thermal/drivers/mediatek: Change clk_prepare_enable to
> devm_clk_get_enabled in mtk_thermal_probe
>
> Krzysztof Kozlowski (1):
>        dt-bindings: thermal: qcom-tsens: Correct unit address
>
> Marijn Suijten (1):
>        dt-bindings: thermal: Use generic ADC node name in examples
>
> Rob Herring (1):
>        thermal/drivers/mediatek: Use of_address_to_resource()
>
> Stefan Wahren (1):
>        dt-bindings: imx-thermal: Add imx6sll and imx6ul compatible
>
>   Documentation/devicetree/bindings/thermal/imx-thermal.yaml         |
> 14 ++++++++++----
>   Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm-hc.yaml |
> 4 ++--
>   Documentation/devicetree/bindings/thermal/qcom-spmi-adc-tm5.yaml   |
> 9 ++++++---
>   Documentation/devicetree/bindings/thermal/qcom-tsens.yaml          |
> 4 ++--
>   drivers/thermal/cpuidle_cooling.c                                  |
> 3 ---
>   drivers/thermal/mediatek/auxadc_thermal.c                          |
> 89
> ++++++++++++++++++++++++++++++++++++++++++++---------------------------------------------
>   6 files changed, 64 insertions(+), 59 deletions(-)

Pulled, thanks!