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Message-ID: <168332392113.3633716.4128640191394678480.robh@kernel.org>
Date: Fri, 5 May 2023 16:58:41 -0500
From: Rob Herring <robh@...nel.org>
To: Varadarajan Narayanan <quic_varada@...cinc.com>
Cc: Praveenkumar I <quic_ipkumar@...cinc.com>,
konrad.dybcio@...aro.org, linux-kernel@...r.kernel.org,
thara.gopinath@...il.com, devicetree@...r.kernel.org,
amitk@...nel.org, andersson@...nel.org, daniel.lezcano@...aro.org,
agross@...nel.org, rui.zhang@...el.com, robh+dt@...nel.org,
linux-arm-msm@...r.kernel.org, linux-pm@...r.kernel.org,
rafael@...nel.org, krzysztof.kozlowski+dt@...aro.org
Subject: Re: [PATCH v1 1/4] dt-bindings: thermal: tsens: Add ipq9574
compatible
On Wed, 03 May 2023 10:15:59 +0530, Varadarajan Narayanan wrote:
> From: Praveenkumar I <quic_ipkumar@...cinc.com>
>
> Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
>
> Signed-off-by: Praveenkumar I <quic_ipkumar@...cinc.com>
> Signed-off-by: Varadarajan Narayanan <quic_varada@...cinc.com>
> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 3 +++
> 1 file changed, 3 insertions(+)
>
Acked-by: Rob Herring <robh@...nel.org>
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