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Message-ID: <cdf26b5b-79d3-3818-1676-4e2be204a0ee@linaro.org>
Date: Mon, 8 May 2023 08:28:29 +0200
From: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To: Varadarajan Narayanan <quic_varada@...cinc.com>, agross@...nel.org,
andersson@...nel.org, konrad.dybcio@...aro.org, amitk@...nel.org,
thara.gopinath@...il.com, rafael@...nel.org,
daniel.lezcano@...aro.org, rui.zhang@...el.com, robh+dt@...nel.org,
krzysztof.kozlowski+dt@...aro.org, linux-arm-msm@...r.kernel.org,
linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Cc: Praveenkumar I <quic_ipkumar@...cinc.com>
Subject: Re: [PATCH v2 1/3] dt-bindings: thermal: tsens: Add ipq9574
compatible
On 08/05/2023 07:32, Varadarajan Narayanan wrote:
> From: Praveenkumar I <quic_ipkumar@...cinc.com>
>
> Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
>
> Acked-by: Rob Herring <robh@...nel.org>
Drop the ack, it's a bigger change.
> Signed-off-by: Praveenkumar I <quic_ipkumar@...cinc.com>
> Signed-off-by: Varadarajan Narayanan <quic_varada@...cinc.com>
> ---
> [v2]:
> Thanks to Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> for the tip to make qcom,ipq8074-tsens as fallback.
> ---
> Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 9 +++++++--
> 1 file changed, 7 insertions(+), 2 deletions(-)
>
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index d1ec963..ea67cf9 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -64,8 +64,11 @@ properties:
> - const: qcom,tsens-v2
>
> - description: v2 of TSENS with combined interrupt
> - enum:
> - - qcom,ipq8074-tsens
> + - const: qcom,ipq8074-tsens
> + - items:
> + - enum:
Please test the patch after changes and before sending. Missing indent
which test would point out.
Best regards,
Krzysztof
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