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Date:   Mon, 8 May 2023 08:28:29 +0200
From:   Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To:     Varadarajan Narayanan <quic_varada@...cinc.com>, agross@...nel.org,
        andersson@...nel.org, konrad.dybcio@...aro.org, amitk@...nel.org,
        thara.gopinath@...il.com, rafael@...nel.org,
        daniel.lezcano@...aro.org, rui.zhang@...el.com, robh+dt@...nel.org,
        krzysztof.kozlowski+dt@...aro.org, linux-arm-msm@...r.kernel.org,
        linux-pm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Cc:     Praveenkumar I <quic_ipkumar@...cinc.com>
Subject: Re: [PATCH v2 1/3] dt-bindings: thermal: tsens: Add ipq9574
 compatible

On 08/05/2023 07:32, Varadarajan Narayanan wrote:
> From: Praveenkumar I <quic_ipkumar@...cinc.com>
> 
> Qualcomm IPQ9574 has tsens v2.3.1 block, which is similar to IPQ8074 tsens.
> 
> Acked-by: Rob Herring <robh@...nel.org>

Drop the ack, it's a bigger change.

> Signed-off-by: Praveenkumar I <quic_ipkumar@...cinc.com>
> Signed-off-by: Varadarajan Narayanan <quic_varada@...cinc.com>
> ---
> [v2]:
> 	Thanks to Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
> 	for the tip to make qcom,ipq8074-tsens as fallback.
> ---
>  Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 9 +++++++--
>  1 file changed, 7 insertions(+), 2 deletions(-)
> 
> diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> index d1ec963..ea67cf9 100644
> --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
> @@ -64,8 +64,11 @@ properties:
>            - const: qcom,tsens-v2
>  
>        - description: v2 of TSENS with combined interrupt
> -        enum:
> -          - qcom,ipq8074-tsens
> +        - const: qcom,ipq8074-tsens
> +        - items:
> +          - enum:

Please test the patch after changes and before sending. Missing indent
which test would point out.

Best regards,
Krzysztof

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