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Message-ID: <38aa02c4-5b8d-4978-96a2-241fe5f94b50@linaro.org>
Date: Mon, 23 Oct 2023 14:52:36 +0200
From: Krzysztof Kozlowski <krzysztof.kozlowski@...aro.org>
To: Zhenhua Huang <quic_zhenhuah@...cinc.com>, agross@...nel.org,
andersson@...nel.org, konrad.dybcio@...aro.org, robh+dt@...nel.org,
krzysztof.kozlowski+dt@...aro.org, conor+dt@...nel.org
Cc: linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org, kernel@...cinc.com,
quic_tingweiz@...cinc.com
Subject: Re: [PATCH v1 1/5] dt-bindings: soc: qcom: Add memory_dump driver
bindings
On 23/10/2023 13:54, Zhenhua Huang wrote:
>
>
> On 2023/10/23 17:27, Krzysztof Kozlowski wrote:
>> On 23/10/2023 11:20, Zhenhua Huang wrote:
>>> Add bindings for the QCOM Memory Dump driver providing debug
>>
>> Bindings are for hardware, not driver. This suggests it is not suitable
>> for bindings at all.
>>
>>> facilities. Firmware dumps system cache, internal memory,
>>> peripheral registers to reserved DDR as per the table which
>>> populated by the driver, after crash and warm reset.
>>
>> Again driver :/
>
> Thanks for pointing out. Qualcomm memory dump device is a reserved
> memory region which is used to communicate with firmware. I will update
> description in next version.
I have still doubts that it is suitable for DT. I usually expect such
firmware feature-drivers to be instantiated by existing firmware
drivers. You do not need DT for this.
Best regards,
Krzysztof
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