linux-kernel - Re: [PATCH v3 08/14] thermal: core: Unexport thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from

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Message-ID: <bab5dfa4-7b75-0f21-e20d-371230df7e8f@huawei.com>
Date: Wed, 21 Aug 2024 17:18:50 +0800
From: "lihuisong (C)" <lihuisong@...wei.com>
To: "Rafael J. Wysocki" <rjw@...ysocki.net>
CC: LKML <linux-kernel@...r.kernel.org>, Daniel Lezcano
	<daniel.lezcano@...aro.org>, Lukasz Luba <lukasz.luba@....com>, Zhang Rui
	<rui.zhang@...el.com>, Linux PM <linux-pm@...r.kernel.org>
Subject: Re: [PATCH v3 08/14] thermal: core: Unexport
 thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip()


在 2024/8/20 0:05, Rafael J. Wysocki 写道:
> From: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
>
> Since thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip()
> are only called locally in the thermal core now, they can be static,
> so change their definitions accordingly and drop their headers from
> the global thermal header file.
The thermal_bind_cdev_to_trip() and thermal_unbind_cdev_from_trip() are 
used by acpi/thermal.c.
I guess that the patch [07/14] I didn't receive must have done that.
If so, I'd like add:
Acked-by: Huisong Li <lihuisong@...wei.com>
>
> No intentional functional impact.
>
> Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@...el.com>
> ---
>
> v2 -> v3: Rebase after dropping patches [04-05/17] from the series
>
> v1 -> v2: No changes
>
> ---
>   drivers/thermal/thermal_core.c |   10 ++++------
>   include/linux/thermal.h        |    8 --------
>   2 files changed, 4 insertions(+), 14 deletions(-)
>
> Index: linux-pm/drivers/thermal/thermal_core.c
> ===================================================================
> --- linux-pm.orig/drivers/thermal/thermal_core.c
> +++ linux-pm/drivers/thermal/thermal_core.c
> @@ -773,7 +773,7 @@ struct thermal_zone_device *thermal_zone
>    *
>    * Return: 0 on success, the proper error value otherwise.
>    */
> -int thermal_bind_cdev_to_trip(struct thermal_zone_device *tz,
> +static int thermal_bind_cdev_to_trip(struct thermal_zone_device *tz,
>   				     const struct thermal_trip *trip,
>   				     struct thermal_cooling_device *cdev,
>   				     unsigned long upper, unsigned long lower,
> @@ -877,7 +877,6 @@ free_mem:
>   	kfree(dev);
>   	return result;
>   }
> -EXPORT_SYMBOL_GPL(thermal_bind_cdev_to_trip);
>   
>   int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
>   				     int trip_index,
> @@ -913,9 +912,9 @@ EXPORT_SYMBOL_GPL(thermal_zone_bind_cool
>    *
>    * Return: 0 on success, the proper error value otherwise.
>    */
> -int thermal_unbind_cdev_from_trip(struct thermal_zone_device *tz,
> -				  const struct thermal_trip *trip,
> -				  struct thermal_cooling_device *cdev)
> +static int thermal_unbind_cdev_from_trip(struct thermal_zone_device *tz,
> +					 const struct thermal_trip *trip,
> +					 struct thermal_cooling_device *cdev)
>   {
>   	struct thermal_instance *pos, *next;
>   
> @@ -945,7 +944,6 @@ unbind:
>   	kfree(pos);
>   	return 0;
>   }
> -EXPORT_SYMBOL_GPL(thermal_unbind_cdev_from_trip);
>   
>   int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
<...>
>
>
>
>
> .