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Message-ID: <Z7SmKoWF0zLoDoLc@finisterre.sirena.org.uk>
Date: Tue, 18 Feb 2025 15:24:26 +0000
From: Mark Brown <broonie@...nel.org>
To: James Calligeros <jcalligeros99@...il.com>
Cc: Liam Girdwood <lgirdwood@...il.com>, Jaroslav Kysela <perex@...ex.cz>,
Takashi Iwai <tiwai@...e.com>, Shenghao Ding <shenghao-ding@...com>,
Kevin Lu <kevin-lu@...com>, Baojun Xu <baojun.xu@...com>,
Dan Murphy <dmurphy@...com>, Rob Herring <robh@...nel.org>,
Krzysztof Kozlowski <krzk+dt@...nel.org>,
Conor Dooley <conor+dt@...nel.org>,
Shi Fu <shifu0704@...ndersoft.com>,
Jean Delvare <jdelvare@...e.com>,
Guenter Roeck <linux@...ck-us.net>,
Alyssa Rosenzweig <alyssa@...enzweig.io>,
Martin PoviĊĦer <povik+lin@...ebit.org>,
Hector Martin <marcan@...can.st>, linux-sound@...r.kernel.org,
linux-kernel@...r.kernel.org, devicetree@...r.kernel.org,
asahi@...ts.linux.dev, linux-hwmon@...r.kernel.org
Subject: Re: [PATCH v2 14/29] ASoC: tas2770: expose die temp to hwmon
On Tue, Feb 18, 2025 at 06:35:48PM +1000, James Calligeros wrote:
> Create and register a hwmon device to export the die temperature
> to the hwmon interface
Oh, so there is actualy a hwmon device added (which was why I thought
you were ignoring my review comments on the last patch...). The
question then becomes why also have the custom ABI for this as well?
sysfs files are also supposed to be documented in Documention/ABI,
though actal enforcement of that is a bit patchy.
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