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Message-ID: <49fc59ed-9d09-46bd-9ca6-99d3445221f7@kernel.org>
Date: Fri, 21 Feb 2025 12:35:59 +0100
From: Krzysztof Kozlowski <krzk@...nel.org>
To: Viken Dadhaniya <quic_vdadhani@...cinc.com>, andersson@...nel.org,
 konrad.dybcio@...aro.org, robh@...nel.org, krzk+dt@...nel.org,
 conor+dt@...nel.org, linux-arm-msm@...r.kernel.org,
 devicetree@...r.kernel.org, linux-kernel@...r.kernel.org
Cc: quic_msavaliy@...cinc.com, quic_anupkulk@...cinc.com
Subject: Re: [PATCH v1] dt-bindings: qcom: geni-se: Rename qcom,geni-se.yaml
 to qcom,geni-se-qup.yaml

On 21/02/2025 09:54, Viken Dadhaniya wrote:
> The qcom,geni-se.yaml file describes the Qualcomm Universal Peripheral
> (QUP) wrapper and the common entities required by QUP to run any Serial
> Engine (SE) as I2C, SPI, UART, or I3C protocol.
> 
> Rename qcom,geni-se.yaml to qcom,geni-se-qup.yaml to better reflect its
> association with QUP (Qualcomm Universal Peripheral) and the compatible
> string.
> 
> Signed-off-by: Viken Dadhaniya <quic_vdadhani@...cinc.com>
> ---
>  .../soc/qcom/{qcom,geni-se.yaml => qcom,geni-se-qup.yaml}       | 2 +-
>  1 file changed, 1 insertion(+), 1 deletion(-)
>  rename Documentation/devicetree/bindings/soc/qcom/{qcom,geni-se.yaml => qcom,geni-se-qup.yaml} (98%)
> 

That's just churn for no real gain. Not even tested churn.

Best regards,
Krzysztof

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