linux-kernel - Re: [PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

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Message-ID: <fu7rhvpo7t2fjx4l7nvzd2cec7loyjeqyvwgochghyyax4nqof@6bat54r3qgov>
Date: Tue, 23 Dec 2025 21:30:46 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rafael@...nel.org,
        daniel.lezcano@...aro.org, rui.zhang@...el.com, lukasz.luba@....com,
        konradybcio@...nel.org, amitk@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, linux-arm-msm@...r.kernel.org,
        devicetree@...r.kernel.org, linux-kernel@...r.kernel.org,
        linux-pm@...r.kernel.org
Subject: Re: [PATCH v1 3/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
 bindings

On Tue, Dec 23, 2025 at 06:02:22PM +0530, Gaurav Kohli wrote:
> The cooling subnode of a remoteproc represents a client of the Thermal
> Mitigation Device QMI service running on it. Each subnode of the cooling
> node represents a single control exposed by the service.
> 
> Add maintainer name also and update this binding for cdsp substem.
> 
> Co-developed-by: Casey Connolly <casey.connolly@...aro.org>
> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> Signed-off-by: Casey Connolly <casey.connolly@...aro.org>
> ---
>  .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>  .../bindings/thermal/qcom,qmi-cooling.yaml    | 99 +++++++++++++++++++
>  2 files changed, 105 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> 
> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> index 63a82e7a8bf8..bbc82253f76b 100644
> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> @@ -77,6 +77,12 @@ properties:
>        and devices related to the ADSP.
>      unevaluatedProperties: false
>  
> +  cooling:
> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> +    description:
> +      Cooling subnode which represents the cooling devices exposed by the Modem.
> +    unevaluatedProperties: false
> +
>  required:
>    - clocks
>    - clock-names
> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> new file mode 100644
> index 000000000000..90b46712d241
> --- /dev/null
> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> @@ -0,0 +1,99 @@
> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> +# Copyright 2023 (c), Linaro Limited
> +
> +%YAML 1.2
> +---
> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> +$schema: http://devicetree.org/meta-schemas/core.yaml#
> +
> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices.
> +
> +maintainers:
> +  - Caleb Connolly <caleb.connolly@...aro.org>

This wasn't updated.

> +  - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> +
> +description:
> +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> +  across multiple remote subsystems. These devices operate based on junction temperature
> +  sensors (TSENS) associated with thermal zones for each subsystem.
> +
> +  Each subnode corresponds to a control interface for a single instance of the TMD
> +  service running on a remote subsystem.
> +
> +definitions:
> +  tmd:
> +    type: object
> +    description: |
> +      A single Thermal Mitigation Device exposed by a remote subsystem.
> +    properties:
> +      label:
> +        maxItems: 1
> +      "#cooling-cells":
> +        $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
> +      phandle: true
> +
> +    required:
> +      - label
> +      - "#cooling-cells"
> +
> +    additionalProperties: false
> +
> +properties:
> +  compatible:
> +    enum:
> +      - qcom,qmi-cooling-modem
> +      - qcom,qmi-cooling-cdsp
> +
> +  vdd:
> +    $ref: "#/definitions/tmd"
> +    description:
> +      Modem processor temperature TMD
> +    properties:
> +      label:
> +        const: modem

Why it being called vdd?

Why do you define modem-specific node here, while the CDSP-specific is
defined under the if block?

> +
> +required:
> +  - compatible
> +
> +allOf:
> +  - if:
> +      properties:
> +        compatible:
> +          contains:
> +            const: qcom,qmi-cooling-cdsp
> +    then:
> +      properties:
> +        cdsp_sw:
> +          $ref: "#/definitions/tmd"
> +          description:
> +            CDSP software TMD
> +          properties:
> +            label:
> +              const: cdsp_sw

Why do we need a label in addition to the node name?

> +
> +unevaluatedProperties: false
> +
> +examples:
> +  - |
> +    remoteproc-cdsp {
> +        cooling {
> +            compatible = "qcom,qmi-cooling-cdsp";
> +
> +            cdsp_sw0: cdsp_sw {

Is it allowed for device node names to have underscores?

> +              label = "cdsp_sw";
> +              #cooling-cells = <2>;
> +            };
> +        };
> +    };
> +
> +    remoteproc-cdsp1 {
> +        cooling {
> +            compatible = "qcom,qmi-cooling-cdsp1";
> +
> +            cdsp_sw1: cdsp_sw {
> +              label = "cdsp_sw";
> +              #cooling-cells = <2>;
> +            };
> +        };
> +    };

What's the point of having the second CDSP block? Could you demonstrate
modem instead?

> +...
> -- 
> 2.34.1
> 

-- 
With best wishes
Dmitry