Message-ID: <6fb993f3-4479-4b37-ab57-91807eeea988@oss.qualcomm.com>
Date: Fri, 30 Jan 2026 12:09:00 +0530
From: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
To: Krzysztof Kozlowski <krzk@...nel.org>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
        lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, amit.kucheria@....qualcomm.com,
        linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        manaf.pallikunhi@....qualcomm.com
Subject: Re: [PATCH v2 1/8] thermal: Add Remote Proc cooling driver


On 1/28/2026 5:02 PM, Krzysztof Kozlowski wrote:
> On Tue, Jan 27, 2026 at 09:27:15PM +0530, Gaurav Kohli wrote:
>> Add a new generic driver for thermal cooling devices that control
> There is no driver here. You did not a single driver entry point.
>
>> remote processors (modem, DSP, etc.) through various communication
>> channels.
>>
>> This driver provides an abstraction layer between the thermal
> Please read coding style how much we like abstraction layers.
>
>> subsystem and vendor-specific remote processor communication
>> mechanisms.
>>
>> Advantage of this to avoid duplicating vendor-specific logic
>> in the thermal subsystem and make it easier for different vendors
>> to plug in their own cooling mechanisms via callbacks.
>>
>> Suggested-by: Amit Kucheria <amit.kucheria@....qualcomm.com>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> ---
>>   MAINTAINERS                          |   7 ++
>>   drivers/thermal/Kconfig              |  10 ++
>>   drivers/thermal/Makefile             |   2 +
>>   drivers/thermal/remoteproc_cooling.c | 143 +++++++++++++++++++++++++++
>>   include/linux/remoteproc_cooling.h   |  52 ++++++++++
>>   5 files changed, 214 insertions(+)
>>   create mode 100644 drivers/thermal/remoteproc_cooling.c
>>   create mode 100644 include/linux/remoteproc_cooling.h
>>
>> diff --git a/MAINTAINERS b/MAINTAINERS
>> index 414f44093269..5ebc7819d2cf 100644
>> --- a/MAINTAINERS
>> +++ b/MAINTAINERS
>> @@ -26169,6 +26169,13 @@ F:	drivers/thermal/cpufreq_cooling.c
>>   F:	drivers/thermal/cpuidle_cooling.c
>>   F:	include/linux/cpu_cooling.h
>>   
>> +THERMAL/REMOTEPROC_COOLING
>> +M:	Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> +L:	linux-pm@...r.kernel.org
>> +S:	Supported
>> +F:	drivers/thermal/remoteproc_cooling.c
>> +F:	include/linux/remoteproc_cooling.h
>> +
>>   THERMAL/POWER_ALLOCATOR
> Please beginning of this file. P < R.
>

will update this ordering.


>>   M:	Lukasz Luba <lukasz.luba@....com>
>>   L:	linux-pm@...r.kernel.org
>> diff --git a/drivers/thermal/Kconfig b/drivers/thermal/Kconfig
>> index b10080d61860..dfc52eed64de 100644
>> --- a/drivers/thermal/Kconfig
>> +++ b/drivers/thermal/Kconfig
>> @@ -229,6 +229,16 @@ config PCIE_THERMAL
>>   
>>   	  If you want this support, you should say Y here.
>>   
>> +config REMOTEPROC_THERMAL
>> +	tristate "Remote processor cooling support"
>> +	help
>> +	  This implements a generic cooling mechanism for remote processors
>> +	  (modem, DSP, etc.) that allows vendor-specific implementations to
>> +	  register thermal cooling devices and provide callbacks for thermal
>> +	  mitigation.
>> +
>> +	  If you want this support, you should say Y here.
>> +
>>   config THERMAL_EMULATION
>>   	bool "Thermal emulation mode support"
>>   	help
>> diff --git a/drivers/thermal/Makefile b/drivers/thermal/Makefile
>> index bb21e7ea7fc6..ae747dde54fe 100644
>> --- a/drivers/thermal/Makefile
>> +++ b/drivers/thermal/Makefile
>> @@ -34,6 +34,8 @@ thermal_sys-$(CONFIG_DEVFREQ_THERMAL) += devfreq_cooling.o
>>   
>>   thermal_sys-$(CONFIG_PCIE_THERMAL) += pcie_cooling.o
>>   
>> +thermal_sys-$(CONFIG_REMOTEPROC_THERMAL) += remoteproc_cooling.o
>> +
>>   obj-$(CONFIG_K3_THERMAL)	+= k3_bandgap.o k3_j72xx_bandgap.o
>>   # platform thermal drivers
>>   obj-y				+= broadcom/
>> diff --git a/drivers/thermal/remoteproc_cooling.c b/drivers/thermal/remoteproc_cooling.c
>> new file mode 100644
>> index 000000000000..f958efa691b3
>> --- /dev/null
>> +++ b/drivers/thermal/remoteproc_cooling.c
>> @@ -0,0 +1,143 @@
>> +// SPDX-License-Identifier: GPL-2.0
>> +/*
>> + * Remote Processor Cooling Device
>> + *
>> + * Copyright (c) Qualcomm Technologies, Inc. and/or its subsidiaries.
>> + */
>> +
>> +#include <linux/err.h>
>> +#include <linux/export.h>
>> +#include <linux/module.h>
>> +#include <linux/mutex.h>
>> +#include <linux/of.h>
> Where do you use it?


thanks for pointing this, this won't be used anymore.

We had originally plan to parse dt from here, and included was added for 
that earlier approach.

Will fix this.


>> +#include <linux/slab.h>
>> +#include <linux/thermal.h>
>> +
>> +#define REMOTEPROC_PREFIX		"rproc_"
>> +
>> +struct remoteproc_cooling_ops {
>> +	int (*get_max_level)(void *devdata, unsigned long *level);
>> +	int (*get_cur_level)(void *devdata, unsigned long *level);
>> +	int (*set_cur_level)(void *devdata, unsigned long level);
>> +};
>> +
>> +/**
>> + * struct remoteproc_cdev - Remote processor cooling device
>> + * @cdev: Thermal cooling device handle
>> + * @ops: Vendor-specific operation callbacks
>> + * @devdata: Private data for vendor implementation
>> + * @np: Device tree node associated with this cooling device
>> + * @lock: Mutex to protect cooling device operations
>> + */
>> +struct remoteproc_cdev {
>> +	struct thermal_cooling_device *cdev;
>> +	const struct remoteproc_cooling_ops *ops;
>> +	void *devdata;
>> +	struct mutex lock;
>> +};
>> +
>> +/* Thermal cooling device callbacks */
>> +
>> +static int remoteproc_get_max_state(struct thermal_cooling_device *cdev,
>> +				    unsigned long *state)
>> +{
>> +	struct remoteproc_cdev *rproc_cdev = cdev->devdata;
>> +	int ret;
>> +
>> +	mutex_lock(&rproc_cdev->lock);
>> +	ret = rproc_cdev->ops->get_max_level(rproc_cdev->devdata, state);
>> +	mutex_unlock(&rproc_cdev->lock);
>> +
>> +	return ret;
>> +}
>> +
>> +static int remoteproc_get_cur_state(struct thermal_cooling_device *cdev,
>> +				    unsigned long *state)
>> +{
>> +	struct remoteproc_cdev *rproc_cdev = cdev->devdata;
>> +	int ret;
>> +
>> +	mutex_lock(&rproc_cdev->lock);
>> +	ret = rproc_cdev->ops->get_cur_level(rproc_cdev->devdata, state);
>> +	mutex_unlock(&rproc_cdev->lock);
>> +
>> +	return ret;
>> +}
>> +
>> +static int remoteproc_set_cur_state(struct thermal_cooling_device *cdev,
>> +				    unsigned long state)
>> +{
>> +	struct remoteproc_cdev *rproc_cdev = cdev->devdata;
>> +	int ret;
>> +
>> +	mutex_lock(&rproc_cdev->lock);
>> +	ret = rproc_cdev->ops->set_cur_level(rproc_cdev->devdata, state);
>> +	mutex_unlock(&rproc_cdev->lock);
>> +
>> +	return ret;
>> +}
>> +
>> +static const struct thermal_cooling_device_ops remoteproc_cooling_ops = {
>> +	.get_max_state = remoteproc_get_max_state,
>> +	.get_cur_state = remoteproc_get_cur_state,
>> +	.set_cur_state = remoteproc_set_cur_state,
>> +};
>> +
>> +struct remoteproc_cdev *
>> +remoteproc_cooling_register(struct device_node *np,
>> +			    const char *name, const struct remoteproc_cooling_ops *ops,
>> +			     void *devdata)
>> +{
>> +	struct remoteproc_cdev *rproc_cdev;
>> +	struct thermal_cooling_device *cdev;
>> +	int ret;
>> +
>> +	if (!name || !ops)
>> +		return ERR_PTR(-EINVAL);
>> +
>> +	rproc_cdev = kzalloc(sizeof(*rproc_cdev), GFP_KERNEL);
>> +	if (!rproc_cdev)
>> +		return ERR_PTR(-ENOMEM);
>> +
>> +	rproc_cdev->ops = ops;
>> +	rproc_cdev->devdata = devdata;
>> +	mutex_init(&rproc_cdev->lock);
>> +
>> +	char *rproc_name __free(kfree) =
>> +		kasprintf(GFP_KERNEL, REMOTEPROC_PREFIX "%s", name);
>> +	/* Register with thermal framework */
>> +	if (np)
>> +		cdev = thermal_of_cooling_device_register(np, rproc_name, rproc_cdev,
>> +							  &remoteproc_cooling_ops);
>> +	else
>> +		cdev = thermal_cooling_device_register(rproc_name, rproc_cdev,
>> +						       &remoteproc_cooling_ops);
>> +
>> +	if (IS_ERR(cdev)) {
>> +		ret = PTR_ERR(cdev);
>> +		goto free_rproc_cdev;
>> +	}
>> +
>> +	rproc_cdev->cdev = cdev;
>> +
>> +	return rproc_cdev;
>> +
>> +free_rproc_cdev:
>> +	kfree(rproc_cdev);
>> +	return ERR_PTR(ret);
>> +}
>> +EXPORT_SYMBOL_GPL(remoteproc_cooling_register);
>> +
>> +void remoteproc_cooling_unregister(struct remoteproc_cdev *rproc_cdev)
>> +{
>> +	if (!rproc_cdev)
>> +		return;
>> +
>> +	thermal_cooling_device_unregister(rproc_cdev->cdev);
>> +	mutex_destroy(&rproc_cdev->lock);
>> +	kfree(rproc_cdev);
>> +}
>> +EXPORT_SYMBOL_GPL(remoteproc_cooling_unregister);
>> +
>> +MODULE_LICENSE("GPL");
>> +MODULE_DESCRIPTION("Remote Processor Cooling Device");
> I do not see any driver here, just bunch of exported functions. I do not
> see point in this abstraction/wrapping layer.
>
> Another abstraction layer, NAK.


Thanks Krzysztof for review.

We need this abstraction layer to provide a common interface that 
multiple vendors can rely on for

their remote processor based cooling communication. If we use 
QMI-cooling driver only, then solution will

be qualcomm specific only or other's can not extend that.


>
> Best regards,
> Krzysztof
>

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