linux-kernel - Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

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Message-ID: <09298c37-4cbf-4486-b720-5e96cc08a1ab@oss.qualcomm.com>
Date: Fri, 30 Jan 2026 12:38:52 +0530
From: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
To: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
        lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, amit.kucheria@....qualcomm.com,
        linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        manaf.pallikunhi@....qualcomm.com
Subject: Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
 bindings


On 1/29/2026 6:15 AM, Dmitry Baryshkov wrote:
> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
>> The cooling subnode of a remoteproc represents a client of the Thermal
>> Mitigation Device QMI service running on it. Each subnode of the cooling
>> node represents a single control exposed by the service.
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> ---
>>   .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>>   .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
>>   2 files changed, 78 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> index 68c17bf18987..6a736161d5ae 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -80,6 +80,12 @@ properties:
>>         and devices related to the ADSP.
>>       unevaluatedProperties: false
>>   
>> +  cooling:
>> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
>> +    description:
>> +      Cooling subnode which represents the cooling devices exposed by the Modem.
>> +    unevaluatedProperties: false
>> +
>>   required:
>>     - clocks
>>     - clock-names
>> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> new file mode 100644
>> index 000000000000..0dd3bd84c176
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> @@ -0,0 +1,72 @@
>> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
>> +
>> +%YAML 1.2
>> +---
>> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
>> +$schema: http://devicetree.org/meta-schemas/core.yaml#
>> +
>> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
>> +
>> +maintainers:
>> +  - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> +
>> +description:
>> +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
>> +  across multiple remote subsystems. These devices operate based on junction
>> +  temperature sensors (TSENS) associated with thermal zones for each subsystem.
>> +
>> +properties:
>> +  compatible:
>> +    enum:
>> +      - qcom,qmi-cooling-cdsp
>> +      - qcom,qmi-cooling-cdsp1
> If I read your schema as you've it written, then ADSP, SLPI and modem
> also can have _CDSP_ cooling device. Seems like an overkill.
>
> Please take care to describe cooling devices for all DSPs at once and
> describe them properly.
>

Thanks for review.

All the target supported in this series are limited to CDSP, so i will 
update the binding to describe

only the CDSP.