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Message-ID: <6zoth72n4pgzmfafv2sqhhsyiqz727t5wnrono4jicvxxhzu4n@bdw5643qieov>
Date: Fri, 30 Jan 2026 11:02:25 +0200
From: Dmitry Baryshkov <dmitry.baryshkov@....qualcomm.com>
To: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
casey.connolly@...aro.org, amit.kucheria@....qualcomm.com,
linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
manaf.pallikunhi@....qualcomm.com
Subject: Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
bindings
On Fri, Jan 30, 2026 at 12:38:52PM +0530, Gaurav Kohli wrote:
>
> On 1/29/2026 6:15 AM, Dmitry Baryshkov wrote:
> > On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
> > > The cooling subnode of a remoteproc represents a client of the Thermal
> > > Mitigation Device QMI service running on it. Each subnode of the cooling
> > > node represents a single control exposed by the service.
> > >
> > > Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> > > ---
> > > .../bindings/remoteproc/qcom,pas-common.yaml | 6 ++
> > > .../bindings/thermal/qcom,qmi-cooling.yaml | 72 +++++++++++++++++++
> > > 2 files changed, 78 insertions(+)
> > > create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > >
> > > diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > index 68c17bf18987..6a736161d5ae 100644
> > > --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
> > > @@ -80,6 +80,12 @@ properties:
> > > and devices related to the ADSP.
> > > unevaluatedProperties: false
> > > + cooling:
> > > + $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
> > > + description:
> > > + Cooling subnode which represents the cooling devices exposed by the Modem.
> > > + unevaluatedProperties: false
> > > +
> > > required:
> > > - clocks
> > > - clock-names
> > > diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > new file mode 100644
> > > index 000000000000..0dd3bd84c176
> > > --- /dev/null
> > > +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
> > > @@ -0,0 +1,72 @@
> > > +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
> > > +
> > > +%YAML 1.2
> > > +---
> > > +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
> > > +$schema: http://devicetree.org/meta-schemas/core.yaml#
> > > +
> > > +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
> > > +
> > > +maintainers:
> > > + - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
> > > +
> > > +description:
> > > + Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
> > > + across multiple remote subsystems. These devices operate based on junction
> > > + temperature sensors (TSENS) associated with thermal zones for each subsystem.
> > > +
> > > +properties:
> > > + compatible:
> > > + enum:
> > > + - qcom,qmi-cooling-cdsp
> > > + - qcom,qmi-cooling-cdsp1
> > If I read your schema as you've it written, then ADSP, SLPI and modem
> > also can have _CDSP_ cooling device. Seems like an overkill.
> >
> > Please take care to describe cooling devices for all DSPs at once and
> > describe them properly.
> >
>
> Thanks for review.
>
> All the target supported in this series are limited to CDSP, so i will
> update the binding to describe
>
> only the CDSP.
Why are you limiting yourself to just CDSP? I don't think there is a
significant difference between CDSP and other DSPs from the cooling
point of view.
BTW: could you please also fix your email editor, it inserts extra
unneeded newline characters.
>
>
--
With best wishes
Dmitry
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