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Message-Id: <20150515.124446.727849098381931716.davem@redhat.com>
Date: Fri, 15 May 2015 12:44:46 -0400 (EDT)
From: David Miller <davem@...hat.com>
To: manabian@...il.com
Cc: arnd@...db.de, peppe.cavallaro@...com, roger.chen@...k-chips.com,
wens@...e.org, srinivas.kandagatla@...com,
dinguyen@...nsource.altera.com, b.galvani@...il.com,
netdev@...r.kernel.org, linux-arm-kernel@...ts.infradead.org,
linux-rockchip@...ts.infradead.org
Subject: Re: [PATCH net-next 00/11] convert stmmac glue layers into
platform drivers
From: Joachim Eastwood <manabian@...il.com>
Date: Thu, 14 May 2015 12:10:55 +0200
> This patch set aims to convert the current dwmac glue layers into
> proper platform drivers as request by Arnd[1]. These changes start
> from patch 3 and onwards.
>
> Overview:
> Platform driver functions like probe and remove are exported from
> the stmmac platform and then used in subsequent glue later
> conversions. The conversion involes adding the platform driver
> boiler plate code and adding it to the build system. The last patch
> removes the driver from the stmmac platform code thus making it into
> a library for common platform driver functions.
>
> The two first patches adds glue layer for my platform. I chose to
> first add old style glue layer and then convert it. The churn this
> creates is just 3 lines.
>
> I would be very nice if people could test this patch set on their
> respective platform. My testing has been limited to compiling and
> testing on my (LPC18xx) platform. Thanks!
>
> Next I will look into cleaning up the stmmac platform code.
>
> [1] http://marc.info/?l=linux-arm-kernel&m=143059524606459&w=2
Series applied, thanks Joachim.
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