netdev - Re: [PATCH v2 3/4] net: stmmac: Add glue layer for Loongson-1 SoC

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Message-ID: <ZOESdApO8NN8kDQc@vergenet.net>
Date: Sat, 19 Aug 2023 21:05:24 +0200
From: Simon Horman <horms@...nel.org>
To: Keguang Zhang <keguang.zhang@...il.com>
Cc: netdev@...r.kernel.org, devicetree@...r.kernel.org,
	linux-mips@...r.kernel.org, linux-kernel@...r.kernel.org,
	Lee Jones <lee@...nel.org>, Rob Herring <robh+dt@...nel.org>,
	Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
	Conor Dooley <conor+dt@...nel.org>,
	"David S . Miller" <davem@...emloft.net>,
	Eric Dumazet <edumazet@...gle.com>,
	Jakub Kicinski <kuba@...nel.org>, Paolo Abeni <pabeni@...hat.com>,
	Thomas Bogendoerfer <tsbogend@...ha.franken.de>,
	Giuseppe Cavallaro <peppe.cavallaro@...com>,
	Alexandre Torgue <alexandre.torgue@...s.st.com>,
	Jose Abreu <joabreu@...opsys.com>,
	Serge Semin <Sergey.Semin@...kalelectronics.ru>
Subject: Re: [PATCH v2 3/4] net: stmmac: Add glue layer for Loongson-1 SoC

On Wed, Aug 16, 2023 at 07:13:09PM +0800, Keguang Zhang wrote:
> This glue driver is created based on the arch-code
> implemented earlier with the platform-specific settings.
> 
> Use syscon for SYSCON register access.
> 
> Partialy based on the previous work by Serge Semin.

Hi Keguang Zhang,

as it looks like there will be a v3 for other reasons,
a minor nit from my side: Partialy -> Partially

...