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Message-ID: <20230205152508.778b010a@jic23-huawei>
Date: Sun, 5 Feb 2023 15:25:08 +0000
From: Jonathan Cameron <jic23@...nel.org>
To: Andrew Hepp <andrew.hepp@...pp.dev>
Cc: linux-iio@...r.kernel.org, linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2] iio: temperature: Add MCP9600 thermocouple EMF
converter driver
On Thu, 12 Jan 2023 19:05:51 +0000
Jonathan Cameron <jic23@...nel.org> wrote:
> On Sun, 8 Jan 2023 15:45:04 -0800
> Andrew Hepp <andrew.hepp@...pp.dev> wrote:
>
> > From: "Andrew Hepp" <andrew.hepp@...pp.dev>
> >
> > Add support for the MCP9600 thermocouple EMF converter.
> >
> > Datasheet: https://ww1.microchip.com/downloads/en/DeviceDoc/MCP960X-Data-Sheet-20005426.pdf
> > Signed-off-by: Andrew Hepp <andrew.hepp@...pp.dev>
>
> Driver looks good, but now I realise we don't have a device tree binding doc.
>
> Please add one for v3.
>
> Note that the binding doc is describing the hardware, not what the driver
> currently supports alone, so include the 4 (or 6?) interrupt lines (and interrupt-names
> as any random subset of them might be provided) + VDD regulator + anything else I've
> not noticed in my 10 second look at the datashet.
Hi Andrew,
If you aren't going to get to this sometime soon, feel free to say so and
I might write binding docs for it if I get time. I'd rather do that than
lose a driver over some docs!
Jonathan
>
> Thanks,
>
> Jonathan
>
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