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Message-ID: <20230520162002.7aba7c04@jic23-huawei>
Date:   Sat, 20 May 2023 16:20:02 +0100
From:   Jonathan Cameron <jic23@...nel.org>
To:     Anup Sharma <anupnewsmail@...il.com>
Cc:     Lars-Peter Clausen <lars@...afoo.de>,
        Rob Herring <robh+dt@...nel.org>,
        Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
        Conor Dooley <conor+dt@...nel.org>,
        Peter Meerwald <pmeerw@...erw.net>,
        u.kleine-koenig@...gutronix.de, andriy.shevchenko@...ux.intel.com,
        linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2 0/2] Add dt-binding support for ti tmp006

On Sat, 20 May 2023 16:21:50 +0530
Anup Sharma <anupnewsmail@...il.com> wrote:

> These patches introduce device tree binding support and
> add an of_device_id table entry to the driver.
> 
> Changes in v2:
> 	- Keep the exsisting MODULE_DEVICE_TABLE entry.
> 	- Removed the inner comma in of_device_id.
> 	- Order the included header to improve code organization.
> 	- Adding missing semicolon to fix syntax error detected
> 	  using dt_binding_check.
> 	
LGTM - I'll leave them a little while though for others to comment before
picking them up.

Thanks,

Jonathan

> Anup Sharma (2):
>   dt-bindings: iio: temperature: Add support for tmp006
>   iio: temperature: tmp006: Add OF device matching support
> 
>  .../bindings/iio/temperature/ti,tmp006.yaml   | 42 +++++++++++++++++++
>  drivers/iio/temperature/tmp006.c              |  8 ++++
>  2 files changed, 50 insertions(+)
>  create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
> 

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