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Message-ID: <20230520162002.7aba7c04@jic23-huawei>
Date: Sat, 20 May 2023 16:20:02 +0100
From: Jonathan Cameron <jic23@...nel.org>
To: Anup Sharma <anupnewsmail@...il.com>
Cc: Lars-Peter Clausen <lars@...afoo.de>,
Rob Herring <robh+dt@...nel.org>,
Krzysztof Kozlowski <krzysztof.kozlowski+dt@...aro.org>,
Conor Dooley <conor+dt@...nel.org>,
Peter Meerwald <pmeerw@...erw.net>,
u.kleine-koenig@...gutronix.de, andriy.shevchenko@...ux.intel.com,
linux-iio@...r.kernel.org, devicetree@...r.kernel.org,
linux-kernel@...r.kernel.org
Subject: Re: [PATCH v2 0/2] Add dt-binding support for ti tmp006
On Sat, 20 May 2023 16:21:50 +0530
Anup Sharma <anupnewsmail@...il.com> wrote:
> These patches introduce device tree binding support and
> add an of_device_id table entry to the driver.
>
> Changes in v2:
> - Keep the exsisting MODULE_DEVICE_TABLE entry.
> - Removed the inner comma in of_device_id.
> - Order the included header to improve code organization.
> - Adding missing semicolon to fix syntax error detected
> using dt_binding_check.
>
LGTM - I'll leave them a little while though for others to comment before
picking them up.
Thanks,
Jonathan
> Anup Sharma (2):
> dt-bindings: iio: temperature: Add support for tmp006
> iio: temperature: tmp006: Add OF device matching support
>
> .../bindings/iio/temperature/ti,tmp006.yaml | 42 +++++++++++++++++++
> drivers/iio/temperature/tmp006.c | 8 ++++
> 2 files changed, 50 insertions(+)
> create mode 100644 Documentation/devicetree/bindings/iio/temperature/ti,tmp006.yaml
>
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