Message-Id: <174608807383.1458182.1498162135150593654.robh@kernel.org>
Date: Thu, 01 May 2025 03:27:53 -0500
From: "Rob Herring (Arm)" <robh@...nel.org>
To: Paresh Bhagat <p-bhagat@...com>
Cc: krzk+dt@...nel.org, linux-kernel@...r.kernel.org, v-singh1@...com, 
 vigneshr@...com, linux-arm-kernel@...ts.infradead.org, afd@...com, 
 conor+dt@...nel.org, nm@...com, praneeth@...com, devicetree@...r.kernel.org, 
 khasim@...com, kristo@...nel.org
Subject: Re: [PATCH 1/3] dt-bindings: arm: ti: Add bindings for AM62D2 SoC


On Thu, 01 May 2025 12:59:21 +0530, Paresh Bhagat wrote:
> The AM62D2 SoC belongs to the K3 Multicore SoC architecture with DSP core
> targeted for applications needing high-performance Digital Signal
> Processing. It is used in applications like automotive audio systems,
> professional sound equipment, radar and radio for aerospace, sonar in
> marine devices, and ultrasound in medical imaging. It also supports
> precise signal analysis in test and measurement tools.
> 
> Some highlights of AM62D2 SoC are:
> 
> * Quad-Cortex-A53s (running up to 1.4GHz) in a single cluster.
>   Dual/Single core variants are provided in the same package to allow
>   HW compatible designs.
> * One Device manager Cortex-R5F for system power and resource management,
>   and one Cortex-R5F for Functional Safety or general-purpose usage.
> * DSP with Matrix Multiplication Accelerator(MMA) (up to 2 TOPS) based on
>   single core C7x.
> * 3x Multichannel Audio Serial Ports (McASP) Up to 4/6/16 Serial Data Pins
>   which can Transmit and Receive Clocks up to 50MHz, with multi-channel I2S
>   and TDM Audio inputs and outputs.
> * Integrated Giga-bit Ethernet switch supporting up to a total of two
>   external ports with TSN capable to enable audio networking features such
>   as, Ethernet Audio Video Bridging (eAVB) and Dante.
> * 9xUARTs, 5xSPI, 6xI2C, 2xUSB2, 3xCAN-FD, 3x eMMC and SD, OSPI memory
>   controller, 1x CSI-RX-4L for Camera, eCAP/eQEP, ePWM, among other
>   peripherals.
> * Dedicated Centralized Hardware Security Module with support for secure
>   boot, debug security and crypto acceleration and trusted execution
>   environment.
> * One 32 bit DDR Subsystem that supports LPDDR4, DDR4 memory types.
> * Low power mode support: Partial IO support for CAN/GPIO/UART wakeup.
> 
> This adds dt bindings for TI's AM62D2 family of devices.
> 
> More details about the SoCs can be found in the Technical Reference Manual:
> https://www.ti.com/lit/pdf/sprujd4
> 
> Signed-off-by: Paresh Bhagat <p-bhagat@...com>
> ---
>  Documentation/devicetree/bindings/arm/ti/k3.yaml | 6 ++++++
>  1 file changed, 6 insertions(+)
> 

My bot found errors running 'make dt_binding_check' on your patch:

yamllint warnings/errors:
./Documentation/devicetree/bindings/arm/ti/k3.yaml:37:13: [warning] wrong indentation: expected 14 but found 12 (indentation)

dtschema/dtc warnings/errors:

doc reference errors (make refcheckdocs):

See https://patchwork.ozlabs.org/project/devicetree-bindings/patch/20250501072923.1262414-2-p-bhagat@ti.com

The base for the series is generally the latest rc1. A different dependency
should be noted in *this* patch.

If you already ran 'make dt_binding_check' and didn't see the above
error(s), then make sure 'yamllint' is installed and dt-schema is up to
date:

pip3 install dtschema --upgrade

Please check and re-submit after running the above command yourself. Note
that DT_SCHEMA_FILES can be set to your schema file to speed up checking
your schema. However, it must be unset to test all examples with your schema.

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