linux-kernel - Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml bindings

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Message-ID: <36706481-2549-4716-8e6d-0e4db42591a2@oss.qualcomm.com>
Date: Thu, 29 Jan 2026 17:36:32 +0530
From: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
To: Krzysztof Kozlowski <krzk@...nel.org>
Cc: andersson@...nel.org, mathieu.poirier@...aro.org, robh@...nel.org,
        krzk+dt@...nel.org, conor+dt@...nel.org, rui.zhang@...el.com,
        lukasz.luba@....com, konradybcio@...nel.org, mani@...nel.org,
        casey.connolly@...aro.org, amit.kucheria@....qualcomm.com,
        linux-arm-msm@...r.kernel.org, devicetree@...r.kernel.org,
        linux-kernel@...r.kernel.org, linux-pm@...r.kernel.org,
        manaf.pallikunhi@....qualcomm.com
Subject: Re: [PATCH v2 2/8] dt-bindings: thermal: Add qcom,qmi-cooling yaml
 bindings


On 1/28/2026 4:57 PM, Krzysztof Kozlowski wrote:
> On Tue, Jan 27, 2026 at 09:27:16PM +0530, Gaurav Kohli wrote:
>> The cooling subnode of a remoteproc represents a client of the Thermal
>> Mitigation Device QMI service running on it. Each subnode of the cooling
>> node represents a single control exposed by the service.
>>
>> Signed-off-by: Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> ---
>>   .../bindings/remoteproc/qcom,pas-common.yaml  |  6 ++
>>   .../bindings/thermal/qcom,qmi-cooling.yaml    | 72 +++++++++++++++++++
>>   2 files changed, 78 insertions(+)
>>   create mode 100644 Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>>
>> diff --git a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> index 68c17bf18987..6a736161d5ae 100644
>> --- a/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> +++ b/Documentation/devicetree/bindings/remoteproc/qcom,pas-common.yaml
>> @@ -80,6 +80,12 @@ properties:
>>         and devices related to the ADSP.
>>       unevaluatedProperties: false
>>   
>> +  cooling:
>> +    $ref: /schemas/thermal/qcom,qmi-cooling.yaml#
>> +    description:
>> +      Cooling subnode which represents the cooling devices exposed by the Modem.
> I do not see the reason why you need 3 (!!!) children here. Everything
> should be folded here.


Thanks Krzysztof for review.

Each subsystem may support multiple thermal mitigation devices through 
remote TMD service.

Because of this multiplicity, introduced separate binding file.

>> +    unevaluatedProperties: false
>> +
>>   required:
>>     - clocks
>>     - clock-names
>> diff --git a/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> new file mode 100644
>> index 000000000000..0dd3bd84c176
>> --- /dev/null
>> +++ b/Documentation/devicetree/bindings/thermal/qcom,qmi-cooling.yaml
>> @@ -0,0 +1,72 @@
>> +# SPDX-License-Identifier: (GPL-2.0 OR BSD-2-Clause)
>> +
>> +%YAML 1.2
>> +---
>> +$id: http://devicetree.org/schemas/thermal/qcom,qmi-cooling.yaml#
>> +$schema: http://devicetree.org/meta-schemas/core.yaml#
>> +
>> +title: Qualcomm QMI based thermal mitigation (TMD) cooling devices
>> +
>> +maintainers:
>> +  - Gaurav Kohli <gaurav.kohli@....qualcomm.com>
>> +
>> +description:
>> +  Qualcomm QMI-based TMD cooling devices are used to mitigate thermal conditions
>> +  across multiple remote subsystems. These devices operate based on junction
>> +  temperature sensors (TSENS) associated with thermal zones for each subsystem.
>> +
>> +properties:
>> +  compatible:
>> +    enum:
>> +      - qcom,qmi-cooling-cdsp
>> +      - qcom,qmi-cooling-cdsp1
> What are the differences between them?


Some SOcs support multiple CDSP/NSP instances. Each instance requires 
it's own

compatible string to distinguish.


> Why these are not SoC specific?


They are not soc specific because the qmi thermal mitigation interface 
exposed by CDSP is architecturally

identical across multiple SOCS.


>> +
>> +patternProperties:
>> +  "cdsp-tmd[0-9]*$":
>> +    type: object
> No, you do not need childnode. See writing bindings (covers exactly this
> case).


Each subsystem may support multiple thermal mitigation devices through 
remote TMD service. So

need childnode to distinguish for different mitigations.

>
>> +
>> +    description:
>> +      Each subnode which represents qmi communication to CDSP.
>> +
>> +    properties:
>> +      label:
>> +        maxItems: 1
>> +
>> +      "#cooling-cells":
>> +        $ref: /schemas/thermal/thermal-cooling-devices.yaml#/properties/#cooling-cells
>> +
>> +    required:
>> +      - label
>> +      - "#cooling-cells"
>> +
>> +    additionalProperties: false
>> +
>> +required:
>> +  - compatible
>> +
>> +additionalProperties: false
>> +
>> +examples:
>> +  - |
>> +    remoteproc-cdsp {
>> +        cooling {
>> +            compatible = "qcom,qmi-cooling-cdsp";
>> +
>> +            cdsp_tmd0: cdsp-tmd0 {
>> +              label = "cdsp_sw";
>> +              #cooling-cells = <2>;
>> +            };
>> +        };
>> +    };
>> +
>> +  - |
>> +    remoteproc-cdsp1 {
> No, don't create unnecessary examples. Please read some slides from
> earlier talks so you won't need 10 iterations.


Sure, will update this.


> Best regards,
> Krzysztof
>