netdev - RE: [PATCH iwl-next v3 06/10] ice: Flesh out implementation of support for SRIOV on bonded interface

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Date: Fri, 9 Jun 2023 16:39:18 +0000
From: "Ertman, David M" <david.m.ertman@...el.com>
To: Daniel Machon <daniel.machon@...rochip.com>
CC: "intel-wired-lan@...ts.osuosl.org" <intel-wired-lan@...ts.osuosl.org>,
	"netdev@...r.kernel.org" <netdev@...r.kernel.org>
Subject: RE: [PATCH iwl-next v3 06/10] ice: Flesh out implementation of
 support for SRIOV on bonded interface

> -----Original Message-----
> From: Daniel Machon <daniel.machon@...rochip.com>
> Sent: Friday, June 9, 2023 3:41 AM
> To: Ertman, David M <david.m.ertman@...el.com>
> Cc: intel-wired-lan@...ts.osuosl.org; netdev@...r.kernel.org
> Subject: Re: [PATCH iwl-next v3 06/10] ice: Flesh out implementation of
> support for SRIOV on bonded interface
> 
> > Add in the functions that will allow a VF created on the primary interface
> > of a bond to "fail-over" to another PF interface in the bond and continue
> > to Tx and Rx.
> >
> > Add in an ordered take-down path for the bonded interface.
> >
> > Signed-off-by: Dave Ertman <david.m.ertman@...el.com>
> 
> If you need to respin anyway: s/aggreagte/aggregate/, s/pinter/pointer/
> Otherwise dont bother.

I do need to respin, and changes made 😊

DaveE

> 
> Reviewed-by: Daniel Machon <daniel.machon@...rochip.com>